Master Bond, Inc. Two part toughened epoxy for bonding, sealing and encapsulation features good thermal conductivity Supreme 121AOND

Description
Supreme 121AOND is a thermally conductive, electrically insulative epoxy with superior physical strength properties and a high glass transition temperature. It has a paste consistency and a long working life.
Request a Quote
Description
Supreme 121AOND is a thermally conductive, electrically insulative epoxy with superior physical strength properties and a high glass transition temperature. It has a paste consistency and a long working life.
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
Two part toughened epoxy for bonding, sealing and encapsulation features good thermal conductivity - Supreme 121AOND - Master Bond, Inc.
Hackensack, NJ, USA
Two part toughened epoxy for bonding, sealing and encapsulation features good thermal conductivity
Supreme 121AOND
Two part toughened epoxy for bonding, sealing and encapsulation features good thermal conductivity Supreme 121AOND
Supreme 121AOND is a thermally conductive, electrically insulative epoxy with superior physical strength properties and a high glass transition temperature. It has a paste consistency and a long working life.

Supreme 121AOND is a thermally conductive, electrically insulative epoxy with superior physical strength properties and a high glass transition temperature. It has a paste consistency and a long working life.

Supplier's Site

Technical Specifications

  Master Bond, Inc.
Product Category Industrial Sealants
Product Number Supreme 121AOND
Product Name Two part toughened epoxy for bonding, sealing and encapsulation features good thermal conductivity
Cure / Technology Thermoset; Two Component  
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
Chemical System Epoxy
Features High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
Industry Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
Unlock Full Specs
to access all available technical data

Similar Products

One Component, High Viscosity UV Curable Compound - UV15X-5 - Master Bond, Inc.
Specs
Cure / Technology Thermoset; UV or Radiation Cured; Single Component
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
View Details
Room Temperature Curing Epoxy Features Low Thermal Resistance - EP30TC - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
View Details
One component, high temperature resistant epoxy system for bonding and sealing - EP17HTDA-1 - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Single Component
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
View Details
Tough Epoxy Polysulfide Adhesive Resists High Temperatures - EP21TPHT - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
View Details