Henkel Corporation - Industrial Henkel Loctite STYCAST 2851FT Thermally Conductive Encapsulant Black 1 gal Pail 1188141

Description
Henkel Loctite STYCAST 2851FT Black, formerly Emerson and Cuming, is a one component, heat cured, thermally conductive, epoxy encapsulant. It has a low coefficient of thermal expansion and exhibits excellent resistance to a wide variety of industrial chemicals and solvents. 1 gal Pail.
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Henkel Loctite STYCAST 2851FT Thermally Conductive Encapsulant Black 1 gal Pail - 2851FT BLACK 16LB - Ellsworth Adhesives
Germantown, WI, USA
Henkel Loctite STYCAST 2851FT Thermally Conductive Encapsulant Black 1 gal Pail
2851FT BLACK 16LB
Henkel Loctite STYCAST 2851FT Thermally Conductive Encapsulant Black 1 gal Pail 2851FT BLACK 16LB
Henkel Loctite STYCAST 2851FT Black, formerly Emerson and Cuming, is a one component, heat cured, thermally conductive, epoxy encapsulant. It has a low coefficient of thermal expansion and exhibits excellent resistance to a wide variety of industrial chemicals and solvents. 1 gal Pail.

Henkel Loctite STYCAST 2851FT Black, formerly Emerson and Cuming, is a one component, heat cured, thermally conductive, epoxy encapsulant. It has a low coefficient of thermal expansion and exhibits excellent resistance to a wide variety of industrial chemicals and solvents. 1 gal Pail.

Supplier's Site Datasheet

Technical Specifications

  Ellsworth Adhesives
Product Category Encapsulants and Potting Compounds
Product Number 2851FT BLACK 16LB
Product Name Henkel Loctite STYCAST 2851FT Thermally Conductive Encapsulant Black 1 gal Pail
Type Thermally Conductive
Unlock Full Specs
to access all available technical data

Similar Products

Potting Resin - CG9593-000 - TE Connectivity
Specs
Chemical System Polyurethane; Two-Part Polyurethane
View Details
Ellsworth E-CAST 207-1 Epoxy Adhesive Light Gray 50 mL Cartridge - E-CAST 207-1 50ML CARTRDGE - Ellsworth Adhesives
Specs
Cure / Technology Two Component  
Chemical System Epoxy
Substrate Compatibility Metal; Paper or Paperboard; Plastic
View Details
 - 9092064 - RS Components, Ltd.
RS Components, Ltd.
Specs
Form / Shape Pad
Use Temperature -49 to 257 F (-45 to 125 C)
Thermal Conductivity 2.5 W/m-K (1.44 BTU-ft/hr-ft²-F)
View Details
Thermally Conductive, Electrically Insulative Potting Compound Resists High Temperatures - Supreme 121AO - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
View Details