CRYSTECH, Inc. Datasheets for Laser Processing Equipment

Laser processing equipment uses high-powered lasers to cut, trim, perforate, weld, or join a variety of materials in plate or sheet form.
Laser Processing Equipment: Learn more

Product Name Notes
" RTP (Rubidium Titanyle Phosphate - RbTiOPO4) is an isomorph of KTP crystal which is used in nonlinear and Electro Optical applications. Through years of research and development, CRYSTECH has...
Specifications(585nm) Product Name: DLHP-Y Size: φ31.5x178mm Application: Input 532nm,Output585nm Conversion efficiency: 60-70% Beam Size: Input 12-15mm Output 2-3mm Life Time: >20k pulses Threaded Interface: M22x1.5,Length:8mm Important Note: 1.Input must be...
Specifications(650nm) Product Name: DLHP-R Size: φ31.5x178mm Application: Input 532nm,Output650nm Conversion efficiency: 40-50% Beam Size: Input 12-15mm Output 2-3mm Life Time: >20k pulses Threaded Interface: M22x1.5,Length:8mm Important Note: 1.Input must be...
KD*P (Potassium Dideuterium Phosphate) is the most widely used material for electro-optical applications due to its excellent E-O properties. An electro-optic material such as KD*P can alter the polarization state...
Size: Φ31.5X176.5mm Working wavelength: 1064&532nm or 755nm Max input beam size: Φ12mm Focal Length: 40mm Spot Size: about Φ0.5mm Threaded interface: M22X1.5,Length:8mm
Size: Φ31.5X176.5mm Working wavelength: 1064nm or 532nm Input beam size: Φ12mm Output beam size: 10X10mm Focal Length: 48mm Threaded interface: M22X1.5,Length:8mm