Broadcom Inc. Hermetically Sealed 3.3V, Low IF, Wide VCC, High Gain Optocoupler ACPL-573KL-200

The ACPL-573KL-200 is a highest reliability Class K two channel hermetically sealed 3.3V optocoupler in an 8-Pin DIP ceramic package with solder dipped leads. The solder contains lead. Gold plated leads and various lead forms are also available. See the datasheet for details.
The product is capable of operation and storage over the full military temperature range and may also be purchased as a commercial grade, with full MIL-PRF-38534 Class H level testing or from the DSCC SMD 5962-08227. The ACPL-573KL is manufactured and tested on a MIL-PRF-38534 certified line and the Class H and K versions are included in the DSCC Qualified Products Database Supplemental Information Sheets QPDSIS-38534 as Hybrid Microcircuits.
Each channel contains a GaAsP light emitting diode which is optically coupled to an integrated high gain photon detector. The high gain output stage features an open collector output providing both lower saturation voltage and higher signaling speed than possible with conventional photo-Darlington optocouplers.
The supply voltage can be operated as low as 3.0 V without adversely affecting the parametric performance. These devices have a 300% minimum CTR at an input current of only 0.5 mA making them ideal for use in low input current applications such as MOS, CMOS, low power logic interfaces or line receivers.
Package styles for this die set in one, two or four channels are 8 and 16-Pin DIP through hole. Devices may be purchased with a variety of lead forms and plating options. See the datasheet for details.
Because the same electrical die (emitters and detectors) are used for each channel of each device listed in the datasheet, absolute maximum ratings, recommended operating conditions, electrical specifications, and performance characteristics shown in the datasheet figures are virtually identical for all parts. Occasional exceptions exist due to package variations and limitations and are as noted. Additionally, the same package assembly processes and materials are used in all devices. These similarities justify the use of a common data base for die related reliability.