ECSI Fibrotools Datasheets for Plating and Anodizing Equipment

Plating equipment and anodizing equipment is used to apply a finish to a products to increase its durability or to resist corrosion.
Plating and Anodizing Equipment: Learn more

Product Name Notes
WHAT IT DOES: The Contact Electroplating Technology (CET) enables metallization of isolated electronic patterns by electroplating, without sacrificing the substrate real-estate for establishing direct contact to the power supply. The...
IKo™ Jr. is a practical benchtop tool with the smallest footprint on the market capable of efficiently electroplating 4” wafers with just 1 gallon of solution. Designed for fast electroplating...
The IKo™ STATION™ is a self-contained, complete plating system for MEMS and NANO fabrication – wafer installation, cleaning, activation, DI rinsing and electroplating – ideal for a wide range, 2...
The IKo™ TWIN-STATION™ is a self-contained, complete plating system with two entirely separate IKo™ CLASSIC modules for MEMS and NANO fabrication,includin g wafer installation, cleaning and activation with DI rinsing...
The original. The IKo™ CLASSIC™ is a practical benchtop tool with the smallest footprint for up to 8″ wafers on the market. It’s designed simply to electroplate high-resolution interconnects and...
The Slim version of IKo™ CLASSIC™ is designed to fit a fume hood. With the footprint of 17″ x 28″ it enables fitting up to 3 modules in a fume...