The IKo™ STATION™ is a self-contained, complete plating system for MEMS and NANO fabrication – wafer installation, cleaning, activation, DI rinsing and electroplating – ideal for a wide range, 2 cm2 to 8′ odd shape substrates and wafers.
Easily retrofitted to a cleanroom environment.
The IKo™ Station contains all accessories for processing wafers under one hood. The unit is fabricated with PVC and polypropylene and a minimum of metal parts to avoid potential contamination of electroplating solutions. Metal features are stainless and titanium. All parts can be easily disassembled for maintenance.
Dual power supply for precision reverse pulse plating or potentiostatic operation.
IKoStation’s arrangement of wafer holder, reciprocating anode, reverse pulse rectifier and pump ensure surpassing performance:
Wafer holders, ergonomically designed for easy processing and handling. A full-circle, elastic electric gasket/contact provides uniform current distribution. Result: uniform thickness features across the wafer without leaking solution to the back of the wafer.
Reciprocating anode, a proprietary feature. Provides for an efficient exchange of matter and uniform electric field distribution.
Reverse-pulse rectifier combined with the potentiostat, contribute to equipment versatility. Reverse-pulse current during processing efficiently controls plating thickness distribution along the Z-axis. Potentiostat enables electroplating at precisely-selected potential for specific MEMS and NANO structures.
Fan-out pump with constant filtration (regardless of fine filter medium). Provides a constant flow of high-quality bulk solution.
The IKo™ STATION™ is a self-contained, complete plating system for MEMS and NANO fabrication – wafer installation, cleaning, activation, DI rinsing and electroplating – ideal for a wide range, 2 cm2 to 8″ odd shape substrates and wafers.
Easily retrofitted to a cleanroom environment.
The IKo™ Station contains all accessories for processing wafers under one hood. The unit is fabricated with PVC and polypropylene and a minimum of metal parts to avoid potential contamination of electroplating solutions. Metal features are stainless and titanium. All parts can be easily disassembled for maintenance.
Dual power supply for precision reverse pulse plating or potentiostatic operation.
IKoStation’s arrangement of wafer holder, reciprocating anode, reverse pulse rectifier and pump ensure surpassing performance:
- Wafer holders, ergonomically designed for easy processing and handling. A full-circle, elastic electric gasket/contact provides uniform current distribution. Result: uniform thickness features across the wafer without leaking solution to the back of the wafer.
- Reciprocating anode, a proprietary feature. Provides for an efficient exchange of matter and uniform electric field distribution.
- Reverse-pulse rectifier combined with the potentiostat, contribute to equipment versatility. Reverse-pulse current during processing efficiently controls plating thickness distribution along the Z-axis. Potentiostat enables electroplating at precisely-selected potential for specific MEMS and NANO structures.
- Fan-out pump with constant filtration (regardless of fine filter medium). Provides a constant flow of high-quality bulk solution.
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ECSI Fibrotools
