Advanced Interconnections Corp. Datasheets for IC Interconnect Components
IC interconnect components interface or connect a microelectronic semiconductor chip to a board or larger scale device.
IC Interconnect Components: Learn more
| Product Name | Notes |
|---|---|
| .100" (2.54mm) Pitch Dual Row Right Angle Board to Board Connectors featuring screw-machined terminals provide high reliability method of interconnecting PCB to PCB. | |
| .100" (2.54mm) Pitch Single Row Right Angle Board to Board Connectors featuring screw-machined terminals provide high reliability method of interconnecting PCB to PCB. | |
| Adapters for Jedec .050" (1.27mm) Pitch PLCC's (Leaded Type A) feature our own patented Murphy Circuits®. | |
| Advanced designs and manufactures hundreds of RoHS Compliant screw-machined terminals for our high quality sockets, adapters, and connectors. Advanced also offers a complete line of EMC insulated and non-insulated terminals... | |
| Advanced designs and manufactures hundreds of screw-machined terminals for our high quality sockets, adapters, and connectors. Advanced also offers a complete line of EMC® insulated and non-insulated terminals and... | |
| Advanced's Test Point Pins are precision machined from Brass Copper Alloy can be individually packaged in tape and reel pockets to facilitate automated insertion. To further reduce processing costs when... | |
| B2B® SMT Connectors, featuring solder ball terminals on 1.27mm pitch, provide a high density, high reliability method to define stack height between two PC boards. Compact design conserves board space... | |
| BGA Socketing Systems from Advanced offer an economical and dependable alternative to direct device attach. Our patented SMT designs are field-proven in production, development, programming and test applications. Compact designs... | |
| Low Profile Peel-A-Way® DIP Sockets feature screw-machined terminals in a RoHS Compliant, removable carrier. Standard and custom designs are available along with unique solder perform terminals. | |
| Low Profile Peel-A-Way® Single In-line (SIP) Adapters feature screw-machined terminals in a RoHS Compliant, removable carrier. Standard and custom designs are available along with unique solder perform terminals. | |
| Low Profile Peel-A-Way® SIP Sockets feature screw-machined terminals in a RoHS Compliant, removable carrier. Standard and custom designs are available along with unique solder perform terminals. | |
| Mezza-pede® low profile 1.00mm pitch SMT Connectors from Advanced are designed for board-to-board or cable-to-board applications where long-term reliability is required. | |
| Our Flip-Top™ BGA Socket is engineered for test, programming, development, and production applications. This unique design dramatically reduces PC board space required for BGA and LGA device testing and socketing. | |
| Our high quality, dependable DIP Sockets and Adapters accommodate applications from surface mount to thru-hole. Screw-machined terminals offer superior quality for long-term durability. | |
| Our low insertion force Pin Grid Array (PGA) Sockets and Adapters are available in a variety of RoHS Compliant insulators with hundreds of screw-machined terminal choices. Virtually any PGA footprint... | |
| Our Peel-A-Way® Pin Grid Array (PGA) Sockets are designed for low profile applications and feature our patented removable terminal carrier and high reliability screw-machined terminals. Virtually any PGA footprint can... | |
| Peel-A-Way® Single In-Line Sockets and Adapters for Surface Mount applications are supplied in high temperature Peel-A-Way® removable terminal carriers and feature screw-machined terminals for ultimate reliability. | |
| Rectangular Type Adapters for .050" (1.27mm) Pitch SOIC Devices (SOIC to DIP). RoHS Compliant designs and mating DIP Sockets are available. | |
| RoHS Compliant image sensor sockets are designed to reduce costs by protecting valuable sensors from damage during board assembly and processing. Customized to your exact device requirements. | |
| Single and Dual Row Board to Board Connectors in RoHS Compliant high temp. molded LCP insulators or RoHS Compliant Peel-A-Way® removable carriers featuring screw-machined terminals for superior durability. Typical stack... | |
| Single In-Line "Snap SIP" Adapter Strips are breakable at .100" (2.54mm) increments for ultimate inventory flexibility. | |
| Single In-Line "Snap SIP" Socket Strips are breakable at .100" (2.54mm) increments for ultimate inventory flexibility. | |
| Single, Dual and Triple Row Board to Board Connectors featuring screw-machined terminals available in either RoHS Compliant high temp. molded LCP insulators, FR-4 or Peel-A-Way® removable terminal carriers. Typical mated... | |
| Single, Dual, and Triple Row Board to Board Connectors featuring screw-machined terminals available in RoHS Compliant Peel-A-Way® removable terminal carriers with typical mated heights from .046" (1.17mm) to .240" (6.10mm)... | |
| Solid Body SIP Adapters are precision molded from high temp. LCP in standard lengths from 3 to 32 positions, all featuring screw-machined terminals for ultimate reliability. | |
| Solid Body SIP Sockets are precision molded from high temp. LCP in standard lengths from 3 to 32 positions, all featuring screw-machined terminals for ultimate reliability. | |
| The new Mod5 Series Flip-Top™ BGA Socket is designed for test, debug, and validation of 0.50mm pitch BGA devices. The compact, surface mount design requires no tooling or mounting holes... | |
| This micro-BGA Socket Adapter System in 0.50mm and 0.65mm pitch from Advanced is a breakthrough in fine pitch socket technology. The patented design offers the reliability of screw-machined terminals with... | |
| Using our exclusive, field-proven eutectic solder ball terminal design, the SMT Adapter from Advanced provides a reliable solution for mounting or socketing LGA or re-worked BGA devices. Use in connection... |