ThermalFusion 400 is a supreme thermal compound that includes high thermal conductivity with low thermal resistance. Its non-curing and non-electrical conductive traits can avoid any short circuit incidence. ThermalFusion 400 is the ultimate solution for thermal dissipation to improve CPU, GPU cooling and other bonding applications.
Features:
Specifications:
| Model | RG-TF4-TGU1-GP |
| Color | Gray |
| Specific Gravity | 3.5 |
| Thermal Conductivity | 2.89 (W/m-K) |
| Volume Resistivity | 2.0E+10 (ohm-cm) |
| BLT (Bond Line Thickness) | 0.008 (mm) |
| Volatile content | <0.1 (%) |
| Thermal Resistance | 0.032 (degree Celsius-cm2/W) |
| Weight | 4g |
| UPC Code | 884102002687 |
| Xoxide | |
|---|---|
| Product Category | Heat Sinks |
| Product Number | 70445 |
| Product Name | Cooler Master ThermalFusion 400 High Performance Thermal |
