Xoxide Enzotech Forged Copper BGA Heatsinks - Low-Profile 13007

Description
BCC9 (Bmr-C1L) was a join adventure with a well known Canadian review site bcchardware.com. BCC9 is a refined low profile version of the bmr-c1, with the refined fin height and base thickness, will work with some specific application which has low clearance. Features: ATI® & NVIDIA® Compatible Pure forged copper Easy installation by using 3M™ 8815 Thermal Tape Multipack - Eight (8) piece set Low profile Specification: Dimensions (mm) 14(L) mm x 14mm(W) x 9mm(H) Material C1100 Forged Copper Weight 5g (Each) Thermal Adhesive 3M™ 8815 Thermal Tape ( Datasheet)
Description
BCC9 (Bmr-C1L) was a join adventure with a well known Canadian review site bcchardware.com. BCC9 is a refined low profile version of the bmr-c1, with the refined fin height and base thickness, will work with some specific application which has low clearance. Features: ATI® & NVIDIA® Compatible Pure forged copper Easy installation by using 3M™ 8815 Thermal Tape Multipack - Eight (8) piece set Low profile Specification: Dimensions (mm) 14(L) mm x 14mm(W) x 9mm(H) Material C1100 Forged Copper Weight 5g (Each) Thermal Adhesive 3M™ 8815 Thermal Tape ( Datasheet)

Suppliers

Company
Product
Description
Supplier Links
Enzotech Forged Copper BGA Heatsinks - Low-Profile - 13007 - Xoxide
Malvern, PA, USA
Enzotech Forged Copper BGA Heatsinks - Low-Profile
13007
Enzotech Forged Copper BGA Heatsinks - Low-Profile 13007
BCC9 (Bmr-C1L) was a join adventure with a well known Canadian review site bcchardware.com. BCC9 is a refined low profile version of the bmr-c1, with the refined fin height and base thickness, will work with some specific application which has low clearance. Features: ATI® & NVIDIA® Compatible Pure forged copper Easy installation by using 3M™ 8815 Thermal Tape Multipack - Eight (8) piece set Low profile Specification: Dimensions (mm) 14(L) mm x 14mm(W) x 9mm(H) Material C1100 Forged Copper Weight 5g (Each) Thermal Adhesive 3M™ 8815 Thermal Tape ( Datasheet)

BCC9 (Bmr-C1L) was a join adventure with a well known Canadian review site bcchardware.com. BCC9 is a refined low profile version of the bmr-c1, with the refined fin height and base thickness, will work with some specific application which has low clearance.


Features:

  • ATI® & NVIDIA® Compatible
  • Pure forged copper
  • Easy installation by using 3M™ 8815 Thermal Tape
  • Multipack - Eight (8) piece set
  • Low profile

Specification:


Dimensions (mm)

14(L) mm x 14mm(W) x 9mm(H)

Material

C1100 Forged Copper

Weight

5g (Each)

Thermal Adhesive

3M™ 8815 Thermal Tape (

Datasheet)

Supplier's Site

Technical Specifications

  Xoxide
Product Category Heat Sinks
Product Number 13007
Product Name Enzotech Forged Copper BGA Heatsinks - Low-Profile
Unlock Full Specs
to access all available technical data

Similar Products

Custom BGA 2518 Heat Sink: Precision Thermal Control for Industrial & Embedded Systems -  - ToneCooling Technology Co., Ltd
Specs
Device Thermo-Electric Cooler
L 120 mm (4.72 inch)
W 84 mm (3.31 inch)
View Details
Heatsinks - 1846724 - RS Components, Ltd.
RS Components, Ltd.
Specs
L 45 mm (1.77 inch)
W 45 mm (1.77 inch)
H 11 mm (0.4331 inch)
View Details