Xilinx, Inc. Embedded - Embedded - System On Chip (SoC) - XC7Z100-1FFG900I XC7Z100-1FFG900I

Description
Manufacturer: Xilinx Inc. Win Source Part Number: 903880-XC7Z100-1FFG9 00I Series: Zynq®-7000 Operating Temperature Range: -40°C ~ 100°C (TJ) Features: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC series Kintex™-7 FPGA, 444K Logic Cells 667MHz 900-FCBGA (31x31) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Speed: 667MHz Package: Tube Package: 900-BBGA, FCBGA Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Number of I/O: 212 Family Name: XC7Z100 Categories: Integrated Circuits (ICs) Case / Package: 900-FCBGA (31x31) ECCN: 3A001A7B Popularity: High Fake Threat In the Open Market: 31 pct. Supply and Demand Status: Balance Quantity per package: 1 MSL Level: 4 (72 Hours) Estimated Pruduction Lead Time: 51 Weeks REACH Status: REACH Unaffected HTSUS: 8542.39.0001
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Description
Manufacturer: Xilinx Inc. Win Source Part Number: 903880-XC7Z100-1FFG9 00I Series: Zynq®-7000 Operating Temperature Range: -40°C ~ 100°C (TJ) Features: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC series Kintex™-7 FPGA, 444K Logic Cells 667MHz 900-FCBGA (31x31) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Speed: 667MHz Package: Tube Package: 900-BBGA, FCBGA Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Number of I/O: 212 Family Name: XC7Z100 Categories: Integrated Circuits (ICs) Case / Package: 900-FCBGA (31x31) ECCN: 3A001A7B Popularity: High Fake Threat In the Open Market: 31 pct. Supply and Demand Status: Balance Quantity per package: 1 MSL Level: 4 (72 Hours) Estimated Pruduction Lead Time: 51 Weeks REACH Status: REACH Unaffected HTSUS: 8542.39.0001
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Laguna Hills, CA, United States
Embedded - Embedded - System On Chip (SoC) - XC7Z100-1FFG900I
903880-XC7Z100-1FFG900I
Embedded - Embedded - System On Chip (SoC) - XC7Z100-1FFG900I 903880-XC7Z100-1FFG900I
Manufacturer: Xilinx Inc. Win Source Part Number: 903880-XC7Z100-1FFG9 00I Series: Zynq®-7000 Operating Temperature Range: -40°C ~ 100°C (TJ) Features: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC series Kintex™-7 FPGA, 444K Logic Cells 667MHz 900-FCBGA (31x31) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Speed: 667MHz Package: Tube Package: 900-BBGA, FCBGA Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Number of I/O: 212 Family Name: XC7Z100 Categories: Integrated Circuits (ICs) Case / Package: 900-FCBGA (31x31) ECCN: 3A001A7B Popularity: High Fake Threat In the Open Market: 31 pct. Supply and Demand Status: Balance Quantity per package: 1 MSL Level: 4 (72 Hours) Estimated Pruduction Lead Time: 51 Weeks REACH Status: REACH Unaffected HTSUS: 8542.39.0001

Manufacturer: Xilinx Inc.
Win Source Part Number: 903880-XC7Z100-1FFG900I
Series: Zynq®-7000
Operating Temperature Range: -40°C ~ 100°C (TJ)
Features: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC series Kintex™-7 FPGA, 444K Logic Cells 667MHz 900-FCBGA (31x31)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Speed: 667MHz
Package: Tube
Package: 900-BBGA, FCBGA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Number of I/O: 212
Family Name: XC7Z100
Categories: Integrated Circuits (ICs)
Case / Package: 900-FCBGA (31x31)
ECCN: 3A001A7B
Popularity: High
Fake Threat In the Open Market: 31 pct.
Supply and Demand Status: Balance
Quantity per package: 1
MSL Level: 4 (72 Hours)
Estimated Pruduction Lead Time: 51 Weeks
REACH Status: REACH Unaffected
HTSUS: 8542.39.0001

Buy Now Datasheet
System On Chip (SoC) - XC7Z100-1FFG900I-ND - DigiKey
Thief River Falls, MN, United States
System On Chip (SoC)
XC7Z100-1FFG900I-ND
System On Chip (SoC) XC7Z100-1FFG900I-ND
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 444K Logic Cells 667MHz 900-FCBGA (31x31)

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 444K Logic Cells 667MHz 900-FCBGA (31x31)

Buy Now Datasheet
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) - XC7Z100-1FFG900I - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
XC7Z100-1FFG900I
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) XC7Z100-1FFG900I
IC SOC CORTEX-A9 667MHZ 900FCBGA

IC SOC CORTEX-A9 667MHZ 900FCBGA

Supplier's Site

Technical Specifications

  Win Source Electronics DigiKey Shenzhen Shengyu Electronics Technology Limited
Product Category System on a Chip (SoC) System on a Chip (SoC) System on a Chip (SoC)
Product Number 903880-XC7Z100-1FFG900I XC7Z100-1FFG900I-ND XC7Z100-1FFG900I
Product Name Embedded - Embedded - System On Chip (SoC) - XC7Z100-1FFG900I System On Chip (SoC) Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
Processor Core ARM ARM ARM
Package / Case 900-BBGA, FCBGA 900-BBGA, FCBGA
Number of Inputs/Outputs 212 # 212 #
Operating Temperature -40 to 212 F (-40 to 100 C) -40 to 212 F (-40 to 100 C)
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