Xilinx, Inc. Integrated Circuits (ICs) - Embedded - System On Chip (SoC) XC7Z014S-1CLG400I

Description
Manufacturer: AMD Xilinx Win Source Part Number: 1323123-XC7Z014S-1CL G400I Category: Integrated Circuits (ICs)>Embedded>Syste m On Chip (SoC) Packaging: Tray Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Speed: 667MHz Standard Package: 90 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Number of I/O: 125 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Artix™-7 FPGA, 65K Logic Cells Supplier Device Package: 400-CSPBGA (17x17) Temperature Range - Operating: -40°C ~ 100°C (TJ) Case / Package: 400-LFBGA, CSPBGA ECCN: 3A991D Fake Threat In the Open Market: 67 MSL Level: 3 (168 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Other Part Number: 122-2003 Base Product Number: XC7Z014 RoHS Status: ROHS3 Compliant
Request a Quote Datasheet
Description
Manufacturer: AMD Xilinx Win Source Part Number: 1323123-XC7Z014S-1CL G400I Category: Integrated Circuits (ICs)>Embedded>Syste m On Chip (SoC) Packaging: Tray Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Speed: 667MHz Standard Package: 90 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Number of I/O: 125 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Artix™-7 FPGA, 65K Logic Cells Supplier Device Package: 400-CSPBGA (17x17) Temperature Range - Operating: -40°C ~ 100°C (TJ) Case / Package: 400-LFBGA, CSPBGA ECCN: 3A991D Fake Threat In the Open Market: 67 MSL Level: 3 (168 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Other Part Number: 122-2003 Base Product Number: XC7Z014 RoHS Status: ROHS3 Compliant
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) - 1323123-XC7Z014S-1CLG400I - Win Source Electronics
Laguna Hills, CA, United States
Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
1323123-XC7Z014S-1CLG400I
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) 1323123-XC7Z014S-1CLG400I
Manufacturer: AMD Xilinx Win Source Part Number: 1323123-XC7Z014S-1CL G400I Category: Integrated Circuits (ICs)>Embedded>Syste m On Chip (SoC) Packaging: Tray Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Speed: 667MHz Standard Package: 90 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Number of I/O: 125 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Artix™-7 FPGA, 65K Logic Cells Supplier Device Package: 400-CSPBGA (17x17) Temperature Range - Operating: -40°C ~ 100°C (TJ) Case / Package: 400-LFBGA, CSPBGA ECCN: 3A991D Fake Threat In the Open Market: 67 MSL Level: 3 (168 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Other Part Number: 122-2003 Base Product Number: XC7Z014 RoHS Status: ROHS3 Compliant

Manufacturer: AMD Xilinx
Win Source Part Number: 1323123-XC7Z014S-1CLG400I
Category: Integrated Circuits (ICs)>Embedded>System On Chip (SoC)
Packaging: Tray
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Speed: 667MHz
Standard Package: 90
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Number of I/O: 125
RAM Size: 256KB
Architecture: MCU, FPGA
Primary Attributes: Artix™-7 FPGA, 65K Logic Cells
Supplier Device Package: 400-CSPBGA (17x17)
Temperature Range - Operating: -40°C ~ 100°C (TJ)
Case / Package: 400-LFBGA, CSPBGA
ECCN: 3A991D
Fake Threat In the Open Market: 67
MSL Level: 3 (168 Hours)
REACH Status: REACH Unaffected
HTSUS: 8542.39.0001
Other Part Number: 122-2003
Base Product Number: XC7Z014
RoHS Status: ROHS3 Compliant

Buy Now Datasheet

Technical Specifications

  Win Source Electronics
Product Category Programmable Logic Devices (PLD)
Product Number 1323123-XC7Z014S-1CLG400I
Product Name Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
Package Type Other; 400-LFBGA, CSPBGA
Unlock Full Specs
to access all available technical data

Similar Products

Embedded - PLDs (Programmable Logic Device) - ATF16V8CZ-15XC - Lingto Electronic Limited
Specs
Device Type SPLD
Macrocells 8
View Details
LM2502 Mobile Pixel Link (MPL) Display Interface Serializer and Deserializer - LM2502SQX/NOPB - Texas Instruments
Specs
Device Type SERDES
Operating Current 25 milliamps
Package Type Other; WQFN
View Details
2 suppliers
Industry Pack FPGA Module - IP-EP200 - Acromag, Inc.
Specs
Device Type FPGA
Operating Temperature 0 to 70 C (32 to 158 F)
View Details