Winbond Electronics Corporation America Memory W66CP2NQUAGJ

Description
SDRAM - Mobile LPDDR4 Memory IC 4Gb (128M x 32) LVSTL_11 2.133GHz 3.5ns 200-WFBGA (10x14.5)
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Description
SDRAM - Mobile LPDDR4 Memory IC 4Gb (128M x 32) LVSTL_11 2.133GHz 3.5ns 200-WFBGA (10x14.5)
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Memory - 256-W66CP2NQUAGJ-ND - DigiKey
Thief River Falls, MN, United States
SDRAM - Mobile LPDDR4 Memory IC 4Gb (128M x 32) LVSTL_11 2.133GHz 3.5ns 200-WFBGA (10x14.5)

SDRAM - Mobile LPDDR4 Memory IC 4Gb (128M x 32) LVSTL_11 2.133GHz 3.5ns 200-WFBGA (10x14.5)

Buy Now Datasheet
Integrated Circuits (ICs) - Memory - Memory - W66CP2NQUAGJ - Acme Chip Technology Co., Limited
Shenzhen, China
Integrated Circuits (ICs) - Memory - Memory
W66CP2NQUAGJ
Integrated Circuits (ICs) - Memory - Memory W66CP2NQUAGJ
IC DRAM 4GBIT LVSTL 11 200WFBGA

IC DRAM 4GBIT LVSTL 11 200WFBGA

Supplier's Site
4GB LPDDR4, DDP, X32, 1866MHZ,

4GB LPDDR4, DDP, X32, 1866MHZ,

Supplier's Site Datasheet
Memory - W66CP2NQUAGJ - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
SDRAM - Mobile LPDDR4 Memory IC 4Gbit LVSTL_11 2.133 GHz 3.5 ns 200-WFBGA (10x14.5)

SDRAM - Mobile LPDDR4 Memory IC 4Gbit LVSTL_11 2.133 GHz 3.5 ns 200-WFBGA (10x14.5)

Buy Now Datasheet

Technical Specifications

  DigiKey Acme Chip Technology Co., Limited Lingto Electronic Limited Quarktwin Technology Ltd.
Product Category Memory Chips Memory Chips Memory Chips Memory Chips
Product Number 256-W66CP2NQUAGJ-ND W66CP2NQUAGJ W66CP2NQUAGJ W66CP2NQUAGJ
Product Name Memory Integrated Circuits (ICs) - Memory - Memory Memory Memory
Memory Category DRAM Chip Volatile; DRAM Chip DRAM; DRAM Chip DRAM; DRAM Chip
Operating Temperature -40 to 105 C (-40 to 221 F) -40 to 105 C (-40 to 221 F)
Package Type 200-WFBGA 2.133 GHz BGA; 200-WFBGA
Supply Voltage 1.06V ~ 1.17V, 1.7V ~ 1.95V Surface Mount 1.06V ~ 1.17V, 1.7V ~ 1.95V
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