Wakefield Thermal, Inc. Thermal Adhesive/Compound/Material PPIM00007

Description
1.32"" x 1.32"" Tape
  • Thermal Adhesive/Compound/Material - PPIM00007 - Richardson RFPD
    Richardson RFPD
Request a Quote
Description
1.32"" x 1.32"" Tape
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
Thermal Adhesive/Compound/Material - PPIM00007 - Richardson RFPD
Richardson RFPD
Downers Grove, IL, United States
Thermal Adhesive/Compound/Material
PPIM00007
Thermal Adhesive/Compound/Material PPIM00007
1.32"" x 1.32"" Tape

1.32"" x 1.32"" Tape

Supplier's Site

Technical Specifications

  Richardson RFPD
Product Category Thermal Compounds and Thermal Interface Materials
Product Number PPIM00007
Product Name Thermal Adhesive/Compound/Material
Unlock Full Specs
to access all available technical data

Similar Products

Ultra soft thermal pad for laptop cooling - SF300 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Ultra soft thermal pad for laptop cooling
SF300
Specs
Form / Shape Pad
Industry Electronics
Use Temperature -58 to 392 F (-50 to 200 C)
View Details
High Thermally Conductive and Non-Flammable Silicone Gel Sheet - SARCON ® XR-e - Fujipoly® America Corp.
Fujipoly® America Corp.
High Thermally Conductive and Non-Flammable Silicone Gel Sheet
SARCON ® XR-e
Specs
Form / Shape Gel; Pad; Gap Filler, Foam in Place Gasket
Chemical System Silicone
Gap Fill 0.0394 to 0.0787 inch (1 to 2 mm)
View Details
1-Part, Thermally Conductive, Space-Grade Silicone Adhesive, UL Listed - AS1707 - CHT USA Inc.
CHT USA Inc.
1-Part, Thermally Conductive, Space-Grade Silicone Adhesive, UL Listed
AS1707
Specs
Cure / Technology Single Component; Alkoxy
Chemical System Silicone
Industry Automotive; Electronics
View Details
Ripley™ - E 468-2-7-55F - ELANTAS North America LLC
ELANTAS North America LLC
Ripley™
E 468-2-7-55F
Specs
Type High Dielectric
Cure / Technology Thermoset; Single Component
Form / Shape Liquid
View Details