Wakefield Thermal, Inc.
Thermal Adhesive/Compound/Material
PPIM00003
Description
0.7"" x 0.7"" Tape
Request a Quote
Email Supplier
Description
0.7"" x 0.7"" Tape
Request a Quote
Email Supplier
Technical Specifications
|
Product Category
|
Thermal Compounds and Thermal Interface Materials |
|
Product Number
|
PPIM00003 |
|
Product Name
|
Thermal Adhesive/Compound/Material |
Unlock Full Specs
to access all available technical data
Similar Products
Cure / Technology
Single Component
Form / Shape
Grease, Paste; Gap Filler, Foam in Place Gasket
Use Temperature
32 to 850 F (0 to 454 C)
View Details
Hernon Manufacturing, Inc.
Cure / Technology
Room Temperature Vulcanizing or Curing
Industry
Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Dongguan Sheen Electronic Technology Co., Ltd.
Chemical System
Silicone
Industry
Electronics
Use Temperature
-58 to 392 F (-50 to 200 C)
View Details
Quantaflex Printed Electronics Inc.
Form / Shape
Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry
Electronics; Semiconductors, IC's
Features
EMI/RFI Shielding
View Details
