Wakefield Thermal, Inc. Thermal Adhesive/Compound/Material PL-2-5-254

Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermal Adhesive/Compound/Material - PL-2-5-254 - Richardson RFPD
Geneva, IL, United States
Thermal Adhesive/Compound/Material
PL-2-5-254
Thermal Adhesive/Compound/Material PL-2-5-254
Richardson RFPD, an Arrow Company, is a specialized electronic component distributor providing design engineers with deep technical expertise and localized global design support for the latest new products from the world's leading suppliers of RF, Wireless, Energy and Power Technologies.

Richardson RFPD, an Arrow Company, is a specialized electronic component distributor providing design engineers with deep technical expertise and localized global design support for the latest new products from the world's leading suppliers of RF, Wireless, Energy and Power Technologies.

Supplier's Site Datasheet
Thermal Pad, 25.4X25.4Mm, 2Mm; Thickness Wakefield Thermal - 12AC7725 - Newark, An Avnet Company
Chicago, IL, United States
Thermal Pad, 25.4X25.4Mm, 2Mm; Thickness Wakefield Thermal
12AC7725
Thermal Pad, 25.4X25.4Mm, 2Mm; Thickness Wakefield Thermal 12AC7725
THERMAL PAD, 25.4X25.4MM, 2MM; Thickness:2mm; Conductive Material:Silicone; Thermal Conductivity:5W/m.K; Thermal Impedance:-; Volume Resistivity:-; External Length:25.4mm; External Width:25.4mm; Product Range:ulTIMiFlux Series RoHS Compliant: Yes

THERMAL PAD, 25.4X25.4MM, 2MM; Thickness:2mm; Conductive Material:Silicone; Thermal Conductivity:5W/m.K; Thermal Impedance:-; Volume Resistivity:-; External Length:25.4mm; External Width:25.4mm; Product Range:ulTIMiFlux Series RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Richardson RFPD Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials Thermal Compounds and Thermal Interface Materials
Product Number PL-2-5-254 12AC7725
Product Name Thermal Adhesive/Compound/Material Thermal Pad, 25.4X25.4Mm, 2Mm; Thickness Wakefield Thermal
Thermal Conductivity 5 W/m-K (2.89 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

Thermal Gap Filler - GF400 - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
Specs
Cure / Technology Air Setting / Film Drying; Thermoset; Two Component  
Type / Form Liquid
Chemical System Silicone
View Details
Heat Transfer Compound - NH Nonhardening - Thermon, Inc
Specs
Cure / Technology Single Component
Type / Form Liquid
Features Gap Filler, Foam in Place Gasket; Thermally Conductive
View Details
One Component Thermally Conductive Epoxy Film - FL901AO - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Single Component
Substrate Compatibility Ceramic, Glass; Composites; Metal; Dissimilar Substrates
Chemical System Epoxy
View Details
2-Part, Thermally Conductive Silicone Potting Compound and Encapsulant, UL Listed - QSil-553 - CHT USA Inc.
Specs
Type Thermally Conductive
Cure / Technology Two Component  ; Addition
Features Flame Retardant; UL Rating
View Details