Wakefield Thermal, Inc. Phase Change Pad, Chipset, 25.5Mm; Thickness Wakefield Thermal CD-02-05-C-26

Description
PHASE CHANGE PAD, CHIPSET, 25.5MM; Thickness:0.0762mm; Conductive Material:-; Thermal Conductivity:-; Thermal Impedance:0.107°C/W; Volume Resistivity:-; External Length:25.5mm; External Width:25.5mm; Product Range:ulTIMiFlux Series RoHS Compliant: Yes
Datasheet
Description
PHASE CHANGE PAD, CHIPSET, 25.5MM; Thickness:0.0762mm; Conductive Material:-; Thermal Conductivity:-; Thermal Impedance:0.107°C/W; Volume Resistivity:-; External Length:25.5mm; External Width:25.5mm; Product Range:ulTIMiFlux Series RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Phase Change Pad, Chipset, 25.5Mm; Thickness Wakefield Thermal - 62AC1399 - Newark, An Avnet Company
Chicago, IL, United States
Phase Change Pad, Chipset, 25.5Mm; Thickness Wakefield Thermal
62AC1399
Phase Change Pad, Chipset, 25.5Mm; Thickness Wakefield Thermal 62AC1399
PHASE CHANGE PAD, CHIPSET, 25.5MM; Thickness:0.0762mm; Conductive Material:-; Thermal Conductivity:-; Thermal Impedance:0.107°C/W; Volume Resistivity:-; External Length:25.5mm; External Width:25.5mm; Product Range:ulTIMiFlux Series RoHS Compliant: Yes

PHASE CHANGE PAD, CHIPSET, 25.5MM; Thickness:0.0762mm; Conductive Material:-; Thermal Conductivity:-; Thermal Impedance:0.107°C/W; Volume Resistivity:-; External Length:25.5mm; External Width:25.5mm; Product Range:ulTIMiFlux Series RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 62AC1399
Product Name Phase Change Pad, Chipset, 25.5Mm; Thickness Wakefield Thermal
Unlock Full Specs
to access all available technical data

Similar Products

1-Part, Thermally Conductive, Space-Grade Silicone Adhesive, UL Listed - AS1707 - CHT USA Inc.
Specs
Cure / Technology Single Component; Alkoxy
Chemical System Silicone
Industry Automotive; Electronics
View Details
Thin Film, Very High Thermal Conductivity - SARCON ® YR-a - Fujipoly® America Corp.
Specs
Form / Shape Gap Filler, Foam in Place Gasket
Gap Fill 0.0118 to 0.0335 inch (0.3000 to 0.8500 mm)
Industry Electronics; Semiconductors, IC's
View Details
Formulations - Applications - Thermally Conductive - Dissipator 745 - 745PT - Hernon Manufacturing, Inc.
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Heat Transfer Compound - T-85 - Thermon, Inc
Specs
Cure / Technology Single Component
Form / Shape Die Bonding Adhesives; Grease, Paste
Use Temperature 32 to 450 F (0 to 232 C)
View Details