Wakefield Thermal, Inc. Phase Change Pad, Chipset, 25.5Mm; Thickness Wakefield Thermal CD-02-05-C-26

Description
PHASE CHANGE PAD, CHIPSET, 25.5MM; Thickness:0.0762mm; Conductive Material:-; Thermal Conductivity:-; Thermal Impedance:0.107°C/W; Volume Resistivity:-; External Length:25.5mm; External Width:25.5mm; Product Range:ulTIMiFlux Series RoHS Compliant: Yes
Datasheet
Description
PHASE CHANGE PAD, CHIPSET, 25.5MM; Thickness:0.0762mm; Conductive Material:-; Thermal Conductivity:-; Thermal Impedance:0.107°C/W; Volume Resistivity:-; External Length:25.5mm; External Width:25.5mm; Product Range:ulTIMiFlux Series RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Phase Change Pad, Chipset, 25.5Mm; Thickness Wakefield Thermal - 62AC1399 - Newark, An Avnet Company
Chicago, IL, United States
Phase Change Pad, Chipset, 25.5Mm; Thickness Wakefield Thermal
62AC1399
Phase Change Pad, Chipset, 25.5Mm; Thickness Wakefield Thermal 62AC1399
PHASE CHANGE PAD, CHIPSET, 25.5MM; Thickness:0.0762mm; Conductive Material:-; Thermal Conductivity:-; Thermal Impedance:0.107°C/W; Volume Resistivity:-; External Length:25.5mm; External Width:25.5mm; Product Range:ulTIMiFlux Series RoHS Compliant: Yes

PHASE CHANGE PAD, CHIPSET, 25.5MM; Thickness:0.0762mm; Conductive Material:-; Thermal Conductivity:-; Thermal Impedance:0.107°C/W; Volume Resistivity:-; External Length:25.5mm; External Width:25.5mm; Product Range:ulTIMiFlux Series RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 62AC1399
Product Name Phase Change Pad, Chipset, 25.5Mm; Thickness Wakefield Thermal
Unlock Full Specs
to access all available technical data

Similar Products

Pedigree® - 40 VTC-40F - ELANTAS North America LLC
ELANTAS North America LLC
Specs
Type High Dielectric
Cure / Technology Thermoset; Single Component
Form / Shape Liquid
View Details
Heat Transfer Compound - T-99 - Thermon, Inc
Specs
Cure / Technology Single Component
Form / Shape Die Bonding Adhesives; Grease, Paste
Use Temperature 32 to 2200 F (0 to 1204 C)
View Details
Extremely Soft MasterSil 170 Gel Encapsulant Offers Removability and Optical Clarity - MasterSil 170 Gel - Master Bond, Inc.
Specs
Type High Dielectric; Optical
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Form / Shape Liquid
View Details
High quality thermally conductive thermal gel putty - SE30 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Form / Shape Gel
Chemical System Silicone
Industry Electronics
View Details