Wakefield Thermal, Inc. Phase Change Pad, To-66, 31.8 X 17.8Mm; Thickness Wakefield Thermal CD-02-05-66

Description
PHASE CHANGE PAD, TO-66, 31.8 X 17.8MM; Thickness:0.0762mm; Conductive Material:-; Thermal Conductivity:-; Thermal Impedance:0.107°C/W; Volume Resistivity:-; External Length:31.8mm; External Width:17.8mm RoHS Compliant: Yes
Datasheet
Description
PHASE CHANGE PAD, TO-66, 31.8 X 17.8MM; Thickness:0.0762mm; Conductive Material:-; Thermal Conductivity:-; Thermal Impedance:0.107°C/W; Volume Resistivity:-; External Length:31.8mm; External Width:17.8mm RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Phase Change Pad, To-66, 31.8 X 17.8Mm; Thickness Wakefield Thermal - 62AC1424 - Newark, An Avnet Company
Chicago, IL, United States
Phase Change Pad, To-66, 31.8 X 17.8Mm; Thickness Wakefield Thermal
62AC1424
Phase Change Pad, To-66, 31.8 X 17.8Mm; Thickness Wakefield Thermal 62AC1424
PHASE CHANGE PAD, TO-66, 31.8 X 17.8MM; Thickness:0.0762mm; Conductive Material:-; Thermal Conductivity:-; Thermal Impedance:0.107°C/W; Volume Resistivity:-; External Length:31.8mm; External Width:17.8mm RoHS Compliant: Yes

PHASE CHANGE PAD, TO-66, 31.8 X 17.8MM; Thickness:0.0762mm; Conductive Material:-; Thermal Conductivity:-; Thermal Impedance:0.107°C/W; Volume Resistivity:-; External Length:31.8mm; External Width:17.8mm RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 62AC1424
Product Name Phase Change Pad, To-66, 31.8 X 17.8Mm; Thickness Wakefield Thermal
Unlock Full Specs
to access all available technical data

Similar Products

Ripley™ - E 468-2-7-55F - ELANTAS North America LLC
ELANTAS North America LLC
Specs
Type High Dielectric
Cure / Technology Thermoset; Single Component
Form / Shape Liquid
View Details
Highly Thermal Conductive, Electricity Insulative, Low Viscosity type Silicone Compound - SARCON ® SPG-50A - Fujipoly® America Corp.
Specs
Form / Shape Gap Filler, Foam in Place Gasket
Chemical System Silicone
Industry Electronics; Semiconductors, IC's
View Details
Formulations - Applications - Thermally Conductive - Dissipator 745 - 745PT - Hernon Manufacturing, Inc.
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Heat Transfer Compound - T-85 - Thermon, Inc
Specs
Cure / Technology Single Component
Form / Shape Die Bonding Adhesives; Grease, Paste
Use Temperature 32 to 450 F (0 to 232 C)
View Details