Heat Sink TO-220 Aluminum 6.0W @ 37°C Board Level, Vertical
Wave-solderable pins on 1 in centers for vertical mounting of larger devices on printed circuit boards. Maximum semiconductor package width: 0.625 (15.9).
HEAT SINK; Thermal Resistance:6.17°C/W;
| DigiKey | Richardson RFPD | Newark, An Avnet Company | |
|---|---|---|---|
| Product Category | Heat Sinks | Heat Sinks | Heat Sinks |
| Product Number | 345-1224-ND | 647-15ABPE | 80K7229 |
| Product Name | Heat Sinks | Board Level Heat Sink | Heat Sink; Thermal Resistance Wakefield Thermal |
| Device | Passive Heat Sink | ||
| Mounting | Holes; Socket | PCB | |
| Thermal Resistance | 3.5 °C / W | 3.5 °C / W | 6.17 °C / W |
| Material | Aluminum | Aluminum; Aluminium |
