Wakefield Thermal, Inc. Semiconductor Hardware, Insulators; Insulator Body Material Wakefield Thermal 175-6-510P

Description
SEMICONDUCTOR HARDWARE, INSULATORS; Insulator Body Material:PI (Polyimide) Film; Thermal Conductivity:-; Breakdown Voltage Vbr:6kV; Thickness:0.152mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:- RoHS Compliant: Yes
Datasheet
Description
SEMICONDUCTOR HARDWARE, INSULATORS; Insulator Body Material:PI (Polyimide) Film; Thermal Conductivity:-; Breakdown Voltage Vbr:6kV; Thickness:0.152mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:- RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Semiconductor Hardware, Insulators; Insulator Body Material Wakefield Thermal - 46F7886 - Newark, An Avnet Company
Chicago, IL, United States
Semiconductor Hardware, Insulators; Insulator Body Material Wakefield Thermal
46F7886
Semiconductor Hardware, Insulators; Insulator Body Material Wakefield Thermal 46F7886
SEMICONDUCTOR HARDWARE, INSULATORS; Insulator Body Material:PI (Polyimide) Film; Thermal Conductivity:-; Breakdown Voltage Vbr:6kV; Thickness:0.152mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:- RoHS Compliant: Yes

SEMICONDUCTOR HARDWARE, INSULATORS; Insulator Body Material:PI (Polyimide) Film; Thermal Conductivity:-; Breakdown Voltage Vbr:6kV; Thickness:0.152mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:- RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 46F7886
Product Name Semiconductor Hardware, Insulators; Insulator Body Material Wakefield Thermal
Unlock Full Specs
to access all available technical data

Similar Products

1-Part, Thermally Conductive, Space-Grade Silicone Adhesive, UL Listed - AS1707 - CHT USA Inc.
Specs
Cure / Technology Single Component; Alkoxy
Chemical System Silicone
Industry Automotive; Electronics
View Details
Highly Conformable and Non-Flammable, Higher Thermal interface material - SARCON® PG80B - Fujipoly® America Corp.
Specs
Type High Dielectric
Form / Shape Putty; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
View Details
Formulations - Applications - Thermally Conductive - DISSIPATOR 745D - 745D - Hernon Manufacturing, Inc.
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Heat Transfer Compound - T-3 - Thermon, Inc
Specs
Cure / Technology Single Component
Form / Shape Grease, Paste; Gap Filler, Foam in Place Gasket
Use Temperature 32 to 850 F (0 to 454 C)
View Details