Wakefield Thermal, Inc. Semiconductor Hardware, Insulators; Insulator Body Material Wakefield Thermal 175-6-210P

Description
SEMICONDUCTOR HARDWARE, INSULATORS; Insulator Body Material:PI (Polyimide) Film; Thermal Conductivity:-; Breakdown Voltage Vbr:6kV; Thickness:0.152mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:- RoHS Compliant: Yes
Datasheet
Description
SEMICONDUCTOR HARDWARE, INSULATORS; Insulator Body Material:PI (Polyimide) Film; Thermal Conductivity:-; Breakdown Voltage Vbr:6kV; Thickness:0.152mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:- RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Semiconductor Hardware, Insulators; Insulator Body Material Wakefield Thermal - 46F7846 - Newark, An Avnet Company
Chicago, IL, United States
Semiconductor Hardware, Insulators; Insulator Body Material Wakefield Thermal
46F7846
Semiconductor Hardware, Insulators; Insulator Body Material Wakefield Thermal 46F7846
SEMICONDUCTOR HARDWARE, INSULATORS; Insulator Body Material:PI (Polyimide) Film; Thermal Conductivity:-; Breakdown Voltage Vbr:6kV; Thickness:0.152mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:- RoHS Compliant: Yes

SEMICONDUCTOR HARDWARE, INSULATORS; Insulator Body Material:PI (Polyimide) Film; Thermal Conductivity:-; Breakdown Voltage Vbr:6kV; Thickness:0.152mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:- RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 46F7846
Product Name Semiconductor Hardware, Insulators; Insulator Body Material Wakefield Thermal
Unlock Full Specs
to access all available technical data

Similar Products

Heat Transfer Compound - NH Nonhardening - Thermon, Inc
Specs
Cure / Technology Single Component
Form / Shape Liquid; Gap Filler, Foam in Place Gasket
Use Temperature 32 to 410 F (0 to 210 C)
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details
2-Part, Thermally Conductive Silicone Encapsulants, UL Listed - SE3000 - CHT USA Inc.
Specs
Cure / Technology Two Component  ; Addition
Industry Electronics
Features Flame Retardant; UL Rating
View Details
Thin Film, Low Hardness - SARCON ® QR - Fujipoly® America Corp.
Specs
Form / Shape Gap Filler, Foam in Place Gasket
Gap Fill 0.0118 to 0.0335 inch (0.3000 to 0.8500 mm)
Industry Electronics; Semiconductors, IC's
View Details