Wakefield Thermal, Inc. Semiconductor Hardware, Insulators; Insulator Body Material Wakefield Thermal 174-9-310P

Description
SEMICONDUCTOR HARDWARE, INSULATORS; Insulator Body Material:-; Thermal Conductivity:-; Breakdown Voltage Vbr:5kV; Thickness:0.229mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:- RoHS Compliant: Yes
Datasheet
Description
SEMICONDUCTOR HARDWARE, INSULATORS; Insulator Body Material:-; Thermal Conductivity:-; Breakdown Voltage Vbr:5kV; Thickness:0.229mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:- RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Semiconductor Hardware, Insulators; Insulator Body Material Wakefield Thermal - 81F9797 - Newark, An Avnet Company
Chicago, IL, United States
Semiconductor Hardware, Insulators; Insulator Body Material Wakefield Thermal
81F9797
Semiconductor Hardware, Insulators; Insulator Body Material Wakefield Thermal 81F9797
SEMICONDUCTOR HARDWARE, INSULATORS; Insulator Body Material:-; Thermal Conductivity:-; Breakdown Voltage Vbr:5kV; Thickness:0.229mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:- RoHS Compliant: Yes

SEMICONDUCTOR HARDWARE, INSULATORS; Insulator Body Material:-; Thermal Conductivity:-; Breakdown Voltage Vbr:5kV; Thickness:0.229mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:- RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 81F9797
Product Name Semiconductor Hardware, Insulators; Insulator Body Material Wakefield Thermal
Unlock Full Specs
to access all available technical data

Similar Products

Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details
Formulations - Applications - Thermally Conductive - DISSIPATOR 745D - 745D - Hernon Manufacturing, Inc.
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
2-Part, Silicone Potting Compound and Encapsulant, UL Listed - QSil-563 - CHT USA Inc.
Specs
Cure / Technology Two Component  ; Addition
Industry Automotive; Electronics
Features Flame Retardant; UL Rating
View Details
Radiopaque Two Component Epoxy Compound - EP21BAS - Master Bond, Inc.
Specs
Type High Dielectric
Cure / Technology Thermoset; Two Component  
Form / Shape Die Bonding Adhesives; Optional Premixed and Frozen; Grease, Paste; Gap Filler, Foam in Place Gasket
View Details