Wacker Chemical Corp. Silicone Adhesive, Sealant and Gasket Forming Compound for Electronics; FIPG and CIPG (form in and cure in place gaskets) SEMICOSIL® 988/1K

Description
SEMICOSIL® 988/1K is a non-slump, thermally curable, addition curing one-part silicone rubber. Special features ready-to-use, one-part system thixotropic transparent medium hardness high flexibility (low-stress-adhesive ) rapid heat cure excellent primerless adhesion to many substrates
Description
SEMICOSIL® 988/1K is a non-slump, thermally curable, addition curing one-part silicone rubber. Special features ready-to-use, one-part system thixotropic transparent medium hardness high flexibility (low-stress-adhesive ) rapid heat cure excellent primerless adhesion to many substrates

Suppliers

Company
Product
Description
Supplier Links
Silicone Adhesive, Sealant and Gasket Forming Compound for Electronics; FIPG and CIPG (form in and cure in place gaskets) - SEMICOSIL® 988/1K - Wacker Chemical Corp.
Adrian, MI, USA
Silicone Adhesive, Sealant and Gasket Forming Compound for Electronics; FIPG and CIPG (form in and cure in place gaskets)
SEMICOSIL® 988/1K
Silicone Adhesive, Sealant and Gasket Forming Compound for Electronics; FIPG and CIPG (form in and cure in place gaskets) SEMICOSIL® 988/1K
SEMICOSIL® 988/1K is a non-slump, thermally curable, addition curing one-part silicone rubber. Special features ready-to-use, one-part system thixotropic transparent medium hardness high flexibility (low-stress-adhesive ) rapid heat cure excellent primerless adhesion to many substrates

SEMICOSIL® 988/1K is a non-slump, thermally curable, addition curing one-part silicone rubber.

Special features

  • ready-to-use, one-part system
  • thixotropic
  • transparent
  • medium hardness
  • high flexibility (low-stress-adhesive)
  • rapid heat cure
  • excellent primerless adhesion to many substrates
Supplier's Site

Technical Specifications

  Wacker Chemical Corp.
Product Category Gaskets and Gasketing
Product Number SEMICOSIL® 988/1K
Product Name Silicone Adhesive, Sealant and Gasket Forming Compound for Electronics; FIPG and CIPG (form in and cure in place gaskets)
Gasket Type Cured-in-Place (CIP); Formed-in-Place (FIP)
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