Wacker Chemical Corp. Silicone Adhesive, Sealant and Gasket Forming Compound for Electronics; FIPG and CIPG (form in and cure in place gaskets) SEMICOSIL® 986/1K

Description
SEMICOSIL® 986/1K is a non-slump, thermally curable, addition curing one-part silicone rubber. Special features ready-to-use, one-part system thixotropic translucent medium hardness high flexibility (low-stress-adhesive ) primerless adhesion to many substrates rapid heat cure ultraviolett fluorescing Application general purpose adhesive for the electronics industry FIPG and CIPG applications
Description
SEMICOSIL® 986/1K is a non-slump, thermally curable, addition curing one-part silicone rubber. Special features ready-to-use, one-part system thixotropic translucent medium hardness high flexibility (low-stress-adhesive ) primerless adhesion to many substrates rapid heat cure ultraviolett fluorescing Application general purpose adhesive for the electronics industry FIPG and CIPG applications

Suppliers

Company
Product
Description
Supplier Links
Silicone Adhesive, Sealant and Gasket Forming Compound for Electronics; FIPG and CIPG (form in and cure in place gaskets) - SEMICOSIL® 986/1K - Wacker Chemical Corp.
Adrian, MI, USA
Silicone Adhesive, Sealant and Gasket Forming Compound for Electronics; FIPG and CIPG (form in and cure in place gaskets)
SEMICOSIL® 986/1K
Silicone Adhesive, Sealant and Gasket Forming Compound for Electronics; FIPG and CIPG (form in and cure in place gaskets) SEMICOSIL® 986/1K
SEMICOSIL® 986/1K is a non-slump, thermally curable, addition curing one-part silicone rubber. Special features ready-to-use, one-part system thixotropic translucent medium hardness high flexibility (low-stress-adhesive ) primerless adhesion to many substrates rapid heat cure ultraviolett fluorescing Application general purpose adhesive for the electronics industry FIPG and CIPG applications

SEMICOSIL® 986/1K is a non-slump, thermally curable, addition curing one-part silicone rubber.

Special features

  • ready-to-use, one-part system
  • thixotropic
  • translucent
  • medium hardness
  • high flexibility (low-stress-adhesive)
  • primerless adhesion to many substrates
  • rapid heat cure
  • ultraviolett fluorescing

Application

  • general purpose adhesive for the electronics industry
  • FIPG and CIPG applications
Supplier's Site

Technical Specifications

  Wacker Chemical Corp.
Product Category Gaskets and Gasketing
Product Number SEMICOSIL® 986/1K
Product Name Silicone Adhesive, Sealant and Gasket Forming Compound for Electronics; FIPG and CIPG (form in and cure in place gaskets)
Gasket Type Cured-in-Place (CIP); Formed-in-Place (FIP)
Unlock Full Specs
to access all available technical data

Similar Products

UV Curable Gasket - UV21 - Master Bond, Inc.
Master Bond, Inc.
Specs
Gasket Type Formed-in-Place (FIP)
Cure Method UV Light Cured
Material Silicone Rubber
View Details
ptfe lantern ring -  - Jinshiling (Heyuan) Technology Co., Ltd.
Jinshiling (Heyuan) Technology Co., Ltd.
Specs
Material Polytetrafluoroethylene (PTFE)
Gasket Dimensions 7,customizable
Operating Temperature -328 to 500 F (-200 to 260 C)
View Details