Wacker Chemical Corp. Silicone Adhesive, Sealant and Gasket Forming Compound for Electronics; FIPG and CIPG (form in and cure in place gaskets) SEMICOSIL® 986/1K

Description
SEMICOSIL® 986/1K is a non-slump, thermally curable, addition curing one-part silicone rubber. Special features ready-to-use, one-part system thixotropic translucent medium hardness high flexibility (low-stress-adhesive ) primerless adhesion to many substrates rapid heat cure ultraviolett fluorescing Application general purpose adhesive for the electronics industry FIPG and CIPG applications
Description
SEMICOSIL® 986/1K is a non-slump, thermally curable, addition curing one-part silicone rubber. Special features ready-to-use, one-part system thixotropic translucent medium hardness high flexibility (low-stress-adhesive ) primerless adhesion to many substrates rapid heat cure ultraviolett fluorescing Application general purpose adhesive for the electronics industry FIPG and CIPG applications

Suppliers

Company
Product
Description
Supplier Links
Silicone Adhesive, Sealant and Gasket Forming Compound for Electronics; FIPG and CIPG (form in and cure in place gaskets) - SEMICOSIL® 986/1K - Wacker Chemical Corp.
Adrian, MI, USA
Silicone Adhesive, Sealant and Gasket Forming Compound for Electronics; FIPG and CIPG (form in and cure in place gaskets)
SEMICOSIL® 986/1K
Silicone Adhesive, Sealant and Gasket Forming Compound for Electronics; FIPG and CIPG (form in and cure in place gaskets) SEMICOSIL® 986/1K
SEMICOSIL® 986/1K is a non-slump, thermally curable, addition curing one-part silicone rubber. Special features ready-to-use, one-part system thixotropic translucent medium hardness high flexibility (low-stress-adhesive ) primerless adhesion to many substrates rapid heat cure ultraviolett fluorescing Application general purpose adhesive for the electronics industry FIPG and CIPG applications

SEMICOSIL® 986/1K is a non-slump, thermally curable, addition curing one-part silicone rubber.

Special features

  • ready-to-use, one-part system
  • thixotropic
  • translucent
  • medium hardness
  • high flexibility (low-stress-adhesive)
  • primerless adhesion to many substrates
  • rapid heat cure
  • ultraviolett fluorescing

Application

  • general purpose adhesive for the electronics industry
  • FIPG and CIPG applications
Supplier's Site

Technical Specifications

  Wacker Chemical Corp.
Product Category Gaskets and Gasketing
Product Number SEMICOSIL® 986/1K
Product Name Silicone Adhesive, Sealant and Gasket Forming Compound for Electronics; FIPG and CIPG (form in and cure in place gaskets)
Gasket Type Cured-in-Place (CIP); Formed-in-Place (FIP)
Unlock Full Specs
to access all available technical data

Similar Products

Custom Gaskets -  - Atlantic Rubber Company, Inc.
Atlantic Rubber Company, Inc.
Specs
Gasket Type Sheet / Die-cut
Material Elastomers, Plastics, Vegetable Fiber, Urethane, Non-asbestos Foams and Sponges
View Details
Formulations - Applications - Gasketing - Gasket Replacer® 910 - 391030 - Hernon Manufacturing, Inc.
Specs
Gasket Type Formed-in-Place (FIP)
Cure Method Room Temperature Vulcanizing (RTV)
View Details
Graphite Pressure Seals - ORIGRAF® - Technetics Group
Specs
Material Graphite
Operating Pressure 2900 psi (2041 m H2O)
Operating Temperature -320 to 842 F (-196 to 450 C)
View Details
Seal-Fast: D Series EPDM -  - Device Technologies, Inc.
Device Technologies, Inc.
Specs
Gasket Type Edge Trim
View Details