Wacker Chemical Corp. Shear-thinning, Easy-dispensing, Non-slump, Addition-curing, Two Part Silicone Rubber SEMICOSIL® 961 TC A/B

Description
SEMICOSIL® 961TC A/B is a shear-thinning, easydispensing, non-slump, addition-curing, two part silicone rubber that cures at room temperature to a soft and tacky rubber with excellent thermal conductivity. Special features Gap filler, thermal conductivity 2.3 W/mK Two-part, RT curing Constant properties from –50 °C to +180 °C Low stress, soft and tacky D4-D8 < 350ppm Low abrasive Application Interface material for heat sink applications for the electronics industry
Description
SEMICOSIL® 961TC A/B is a shear-thinning, easydispensing, non-slump, addition-curing, two part silicone rubber that cures at room temperature to a soft and tacky rubber with excellent thermal conductivity. Special features Gap filler, thermal conductivity 2.3 W/mK Two-part, RT curing Constant properties from –50 °C to +180 °C Low stress, soft and tacky D4-D8 < 350ppm Low abrasive Application Interface material for heat sink applications for the electronics industry

Suppliers

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Shear-thinning, Easy-dispensing, Non-slump, Addition-curing, Two Part Silicone Rubber - SEMICOSIL® 961 TC A/B - Wacker Chemical Corp.
Adrian, MI, USA
Shear-thinning, Easy-dispensing, Non-slump, Addition-curing, Two Part Silicone Rubber
SEMICOSIL® 961 TC A/B
Shear-thinning, Easy-dispensing, Non-slump, Addition-curing, Two Part Silicone Rubber SEMICOSIL® 961 TC A/B
SEMICOSIL® 961TC A/B is a shear-thinning, easydispensing, non-slump, addition-curing, two part silicone rubber that cures at room temperature to a soft and tacky rubber with excellent thermal conductivity. Special features Gap filler, thermal conductivity 2.3 W/mK Two-part, RT curing Constant properties from –50 °C to +180 °C Low stress, soft and tacky D4-D8 < 350ppm Low abrasive Application Interface material for heat sink applications for the electronics industry

SEMICOSIL® 961TC A/B is a shear-thinning, easydispensing, non-slump, addition-curing, two part silicone rubber that cures at room temperature to a soft and tacky rubber with excellent thermal conductivity.

Special features

  • Gap filler, thermal conductivity 2.3 W/mK
  • Two-part, RT curing
  • Constant properties from –50 °C to +180 °C
  • Low stress, soft and tacky
  • D4-D8 < 350ppm
  • Low abrasive

Application

Interface material for heat sink applications for the electronics industry

Supplier's Site

Technical Specifications

  Wacker Chemical Corp.
Product Category Rubber Adhesives and Sealants
Product Number SEMICOSIL® 961 TC A/B
Product Name Shear-thinning, Easy-dispensing, Non-slump, Addition-curing, Two Part Silicone Rubber
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Chemical System Silicone
Type / Form Gel
Features High Dielectric; Encapsulant, Potting Compound
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