Wacker Chemical Corp. Dielectric Silicone Gel For Sealing Electronics SEMICOSIL® 924

Description
SEMICOSIL® 924 is a pourable,thermally curable, addition-curing one-part silicone rubber that cures to a very soft silicone gel. Special features one-part, ready-to-use thixotropic flow forms a soft gel on vulcanization low content of volatiles low content of uncured polymer low ion content almost constant properties between -50 °C and +180 °C Application Because of the thixotropic behavior, SEMICOSIL® 924 is specially recommended for local encapsulation of delicate electronic components, e.g. bonded chips on hybrid components which are exposed to extreme external influences
Description
SEMICOSIL® 924 is a pourable,thermally curable, addition-curing one-part silicone rubber that cures to a very soft silicone gel. Special features one-part, ready-to-use thixotropic flow forms a soft gel on vulcanization low content of volatiles low content of uncured polymer low ion content almost constant properties between -50 °C and +180 °C Application Because of the thixotropic behavior, SEMICOSIL® 924 is specially recommended for local encapsulation of delicate electronic components, e.g. bonded chips on hybrid components which are exposed to extreme external influences

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Dielectric Silicone Gel For Sealing Electronics - SEMICOSIL® 924 - Wacker Chemical Corp.
Adrian, MI, USA
Dielectric Silicone Gel For Sealing Electronics
SEMICOSIL® 924
Dielectric Silicone Gel For Sealing Electronics SEMICOSIL® 924
SEMICOSIL® 924 is a pourable,thermally curable, addition-curing one-part silicone rubber that cures to a very soft silicone gel. Special features one-part, ready-to-use thixotropic flow forms a soft gel on vulcanization low content of volatiles low content of uncured polymer low ion content almost constant properties between -50 °C and +180 °C Application Because of the thixotropic behavior, SEMICOSIL® 924 is specially recommended for local encapsulation of delicate electronic components, e.g. bonded chips on hybrid components which are exposed to extreme external influences

SEMICOSIL® 924 is a pourable,thermally curable, addition-curing one-part silicone rubber that cures to a very soft silicone gel.

Special features

  • one-part, ready-to-use
  • thixotropic flow
  • forms a soft gel on vulcanization
  • low content of volatiles
  • low content of uncured polymer
  • low ion content
  • almost constant properties between
  • -50 °C and +180 °C

Application

Because of the thixotropic behavior, SEMICOSIL® 924 is specially recommended for local encapsulation of delicate electronic components, e.g. bonded chips on hybrid components which are exposed to extreme external influences

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Technical Specifications

  Wacker Chemical Corp.
Product Category Rubber Adhesives and Sealants
Product Number SEMICOSIL® 924
Product Name Dielectric Silicone Gel For Sealing Electronics
Cure / Technology Thermoset; Single Component
Chemical System Silicone
Features Encapsulant, Potting Compound
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