Wacker Chemical Corp. Silicone Gel Adhesive, Sealant And Gasketing Material For Electronics ELASTOSIL® N2189

Description
ELASTOSIL® N2189 is a non-slump, one-part silicone sealant, which cures at room temperature under influence of moisture. Special features neutral curing system (alkoxy) short skin forming time non-slump primerless adhesion to many substrates excellent adhesion to cast magnesium good resisitance against mineral oil and coolant good heat stability flame retardant: meets UL94 V-0 Application general-purpose adhesive for technical applications cipg- and fipg-applications e.g. for oil pans
Description
ELASTOSIL® N2189 is a non-slump, one-part silicone sealant, which cures at room temperature under influence of moisture. Special features neutral curing system (alkoxy) short skin forming time non-slump primerless adhesion to many substrates excellent adhesion to cast magnesium good resisitance against mineral oil and coolant good heat stability flame retardant: meets UL94 V-0 Application general-purpose adhesive for technical applications cipg- and fipg-applications e.g. for oil pans

Suppliers

Company
Product
Description
Supplier Links
Silicone Gel Adhesive, Sealant And Gasketing Material For Electronics - ELASTOSIL® N2189 - Wacker Chemical Corp.
Adrian, MI, USA
Silicone Gel Adhesive, Sealant And Gasketing Material For Electronics
ELASTOSIL® N2189
Silicone Gel Adhesive, Sealant And Gasketing Material For Electronics ELASTOSIL® N2189
ELASTOSIL® N2189 is a non-slump, one-part silicone sealant, which cures at room temperature under influence of moisture. Special features neutral curing system (alkoxy) short skin forming time non-slump primerless adhesion to many substrates excellent adhesion to cast magnesium good resisitance against mineral oil and coolant good heat stability flame retardant: meets UL94 V-0 Application general-purpose adhesive for technical applications cipg- and fipg-applications e.g. for oil pans

ELASTOSIL® N2189 is a non-slump, one-part silicone sealant, which cures at room temperature under influence of moisture.

Special features

  • neutral curing system (alkoxy)
  • short skin forming time
  • non-slump
  • primerless adhesion to many substrates
  • excellent adhesion to cast magnesium
  • good resisitance against mineral oil and coolant
  • good heat stability
  • flame retardant: meets UL94 V-0

Application

  • general-purpose adhesive for technical applications
  • cipg- and fipg-applications e.g. for oil pans
Supplier's Site

Technical Specifications

  Wacker Chemical Corp.
Product Category Industrial Sealants
Product Number ELASTOSIL® N2189
Product Name Silicone Gel Adhesive, Sealant And Gasketing Material For Electronics
Cure / Technology Thermoset; Single Component; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
Type / Form Grease, Paste
Substrate Compatibility Metal; Cast Magnesium
Chemical System Silicone; Elastomeric
Unlock Full Specs
to access all available technical data

Similar Products

ELANTAS PDG Epoxylite® E 5302 HI TEMP Epoxy Potting Compound 1 lb Kit - E 5302 HI TEMP 1LB KIT - Ellsworth Adhesives
Specs
Cure / Technology Two Component  
Chemical System Epoxy
Features Encapsulant, Potting Compound
View Details
Sealants - 9015672 - RS Components, Ltd.
RS Components, Ltd.
Specs
Chemical System Silicone
Industry OEM or Industrial; Industrial
View Details
One Part Epoxy for Bonding and Glob Top Applications - Supreme 3HTND-2GT - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Single Component
Type / Form Grease, Paste
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Type / Form Liquid; Sheet or Film
Features EMI/RFI Shielding; Gap Filler, Foam in Place Gasket; Thermally Conductive
Industry Electronics; Semiconductors, IC's
View Details