Wacker Chemical Corp. Silicone Gel Adhesive, Sealant And Gasketing Material For Electronics ELASTOSIL® N2010

Description
ELASTOSIL® N2010 is a self-leveling, one-component silicone sealant, which cures at room temperature under the influence of moisture. Special features neutral curing system (alkoxy) translucent sprayable flowable primerless adhesion to many substrates solvent free Application General-purpose potting and coating grade for technical applications.
Description
ELASTOSIL® N2010 is a self-leveling, one-component silicone sealant, which cures at room temperature under the influence of moisture. Special features neutral curing system (alkoxy) translucent sprayable flowable primerless adhesion to many substrates solvent free Application General-purpose potting and coating grade for technical applications.

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Silicone Gel Adhesive, Sealant And Gasketing Material For Electronics - ELASTOSIL® N2010 - Wacker Chemical Corp.
Adrian, MI, USA
Silicone Gel Adhesive, Sealant And Gasketing Material For Electronics
ELASTOSIL® N2010
Silicone Gel Adhesive, Sealant And Gasketing Material For Electronics ELASTOSIL® N2010
ELASTOSIL® N2010 is a self-leveling, one-component silicone sealant, which cures at room temperature under the influence of moisture. Special features neutral curing system (alkoxy) translucent sprayable flowable primerless adhesion to many substrates solvent free Application General-purpose potting and coating grade for technical applications.

ELASTOSIL® N2010 is a self-leveling, one-component silicone sealant, which cures at room temperature under the influence of moisture.

Special features

  • neutral curing system (alkoxy)
  • translucent
  • sprayable
  • flowable
  • primerless adhesion to many substrates
  • solvent free

Application

General-purpose potting and coating grade for technical applications.

Supplier's Site

Technical Specifications

  Wacker Chemical Corp.
Product Category Industrial Sealants
Product Number ELASTOSIL® N2010
Product Name Silicone Gel Adhesive, Sealant And Gasketing Material For Electronics
Cure / Technology Thermoset; Single Component; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
Type / Form Liquid
Substrate Compatibility Metal; Plastic
Chemical System Silicone; Elastomeric
Features Encapsulant, Potting Compound; Leveling Filling
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