Wacker Chemical Corp. Silicone Gel Adhesive, Sealant And Gasketing Material For Electronics ELASTOSIL® N10

Description
ELASTOSIL® N10 is a flowable silicone sealant which cures at room temperature under influence of atmospheric moisture. Special features neutral-curing system (oxime) low viscosity, no thixotropy solventfree excellent primerless adhesion to many substrates Application Multipurpose grade for bonding, sealing and potting e.g in electronic applications.
Description
ELASTOSIL® N10 is a flowable silicone sealant which cures at room temperature under influence of atmospheric moisture. Special features neutral-curing system (oxime) low viscosity, no thixotropy solventfree excellent primerless adhesion to many substrates Application Multipurpose grade for bonding, sealing and potting e.g in electronic applications.

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Silicone Gel Adhesive, Sealant And Gasketing Material For Electronics - ELASTOSIL® N10 - Wacker Chemical Corp.
Adrian, MI, USA
Silicone Gel Adhesive, Sealant And Gasketing Material For Electronics
ELASTOSIL® N10
Silicone Gel Adhesive, Sealant And Gasketing Material For Electronics ELASTOSIL® N10
ELASTOSIL® N10 is a flowable silicone sealant which cures at room temperature under influence of atmospheric moisture. Special features neutral-curing system (oxime) low viscosity, no thixotropy solventfree excellent primerless adhesion to many substrates Application Multipurpose grade for bonding, sealing and potting e.g in electronic applications.

ELASTOSIL® N10 is a flowable silicone sealant which cures at room temperature under influence of atmospheric moisture.

Special features

  • neutral-curing system (oxime)
  • low viscosity, no thixotropy
  • solventfree
  • excellent primerless adhesion to many substrates

Application

Multipurpose grade for bonding, sealing and potting e.g in electronic applications.

Supplier's Site

Technical Specifications

  Wacker Chemical Corp.
Product Category Industrial Sealants
Product Number ELASTOSIL® N10
Product Name Silicone Gel Adhesive, Sealant And Gasketing Material For Electronics
Cure / Technology Thermoset; Single Component; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
Type / Form Gel
Chemical System Silicone; Elastomeric
Features Encapsulant, Potting Compound
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