Wacker Chemical Corp. One-component, Acid-curing, Low-modulus Silicone Sealant ELASTOSIL® E900

Description
One-component, acid-curing, low-modulus silicone sealant for glazing and industrial applications. Special features solvent-free non-sag ready gunnability at low (+ 5 °C) and high (+ 40 °C) temperatures low shrinkage during vulcanization flexible at low (-40 °C) and high temperatures (+150 °C) low-modulus: better adhesion and higher safety rapid crosslinking: quickly becomes tack-free adheres excellently to glass, vitrified surfaces, ceramic tiles, many plastics and most paints excellent tooling properties long shelf life
Description
One-component, acid-curing, low-modulus silicone sealant for glazing and industrial applications. Special features solvent-free non-sag ready gunnability at low (+ 5 °C) and high (+ 40 °C) temperatures low shrinkage during vulcanization flexible at low (-40 °C) and high temperatures (+150 °C) low-modulus: better adhesion and higher safety rapid crosslinking: quickly becomes tack-free adheres excellently to glass, vitrified surfaces, ceramic tiles, many plastics and most paints excellent tooling properties long shelf life

Suppliers

Company
Product
Description
Supplier Links
One-component, Acid-curing, Low-modulus Silicone Sealant - ELASTOSIL® E900 - Wacker Chemical Corp.
Adrian, MI, USA
One-component, Acid-curing, Low-modulus Silicone Sealant
ELASTOSIL® E900
One-component, Acid-curing, Low-modulus Silicone Sealant ELASTOSIL® E900
One-component, acid-curing, low-modulus silicone sealant for glazing and industrial applications. Special features solvent-free non-sag ready gunnability at low (+ 5 °C) and high (+ 40 °C) temperatures low shrinkage during vulcanization flexible at low (-40 °C) and high temperatures (+150 °C) low-modulus: better adhesion and higher safety rapid crosslinking: quickly becomes tack-free adheres excellently to glass, vitrified surfaces, ceramic tiles, many plastics and most paints excellent tooling properties long shelf life

One-component, acid-curing, low-modulus silicone sealant for glazing and industrial applications.

Special features

  • solvent-free
  • non-sag
  • ready gunnability at low (+ 5 °C) and high (+ 40 °C) temperatures
  • low shrinkage during vulcanization
  • flexible at low (-40 °C) and high temperatures (+150 °C)
  • low-modulus: better adhesion and higher safety
  • rapid crosslinking: quickly becomes tack-free
  • adheres excellently to glass, vitrified surfaces, ceramic tiles, many plastics and most paints
  • excellent tooling properties
  • long shelf life
Supplier's Site

Technical Specifications

  Wacker Chemical Corp.
Product Category Industrial Sealants
Product Number ELASTOSIL® E900
Product Name One-component, Acid-curing, Low-modulus Silicone Sealant
Cure / Technology Thermoset; Single Component; Room Temperature Vulcanizing or Curing
Type / Form Grease, Paste
Substrate Compatibility Ceramic, Glass; Plastic; Wood
Chemical System Silicone; Elastomeric
Unlock Full Specs
to access all available technical data

Similar Products

C-SHIELD RF Conductive Caulking Compound and Sealer -  - Dexmet® Corporation, a part of PPG’s engineered materials division
Dexmet® Corporation, a part of PPG’s engineered materials division
Specs
Type / Form Liquid
Features Caulk, Grout; Electrically Conductive
View Details
Liquid Gap Fillers for Electronics - Electrolube ® LGF200 Liquid Gap Filler - MacDermid Alpha Electronics Solutions
Specs
Cure / Technology Two Component  
Type / Form Liquid
Features Electrically Conductive; Leveling Filling; Gap Filler, Foam in Place Gasket; Thermally Conductive
View Details
1-Part, General Purpose, RTV Silicone Adhesive Sealant - AS1821 - CHT USA Inc.
Specs
Cure / Technology Single Component; Acetone
Chemical System Silicone
Industry Automotive; Electronics
View Details
Heat Transfer Compound - SnapTrace® - Thermon, Inc
Specs
Features Gap Filler, Foam in Place Gasket; Thermally Conductive
Use Temperature 14 to 450 F (-10 to 232 C)
Thermal Conductivity 34.61 to 69.23 W/m-K (20 to 40 BTU-ft/hr-ft²-F)
View Details