Vishay Precision Group Thermal Jumper, Alumi Nitride, 170W/m.k; Thermal Conductivity Vishay THJP0805ABT1

Description
THERMAL JUMPER, ALUMI NITRIDE, 170W/M.K; Thermal Conductivity:170W/m. K; Conductive Material:Aluminium Nitride; Thickness:0.03"; Thermal Impedance:13°C/W; Dielectric Strength:-; External Length:0.079"; External Width:0.047"
  • Thermal Jumper, Alumi Nitride, 170W/m.k; Thermal Conductivity Vishay - 59AJ2390 - Newark, An Avnet Company
    Newark, An Avnet Company
Datasheet
Description
THERMAL JUMPER, ALUMI NITRIDE, 170W/M.K; Thermal Conductivity:170W/m. K; Conductive Material:Aluminium Nitride; Thickness:0.03"; Thermal Impedance:13°C/W; Dielectric Strength:-; External Length:0.079"; External Width:0.047"
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermal Jumper, Alumi Nitride, 170W/m.k; Thermal Conductivity Vishay - 59AJ2390 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Thermal Jumper, Alumi Nitride, 170W/m.k; Thermal Conductivity Vishay
59AJ2390
Thermal Jumper, Alumi Nitride, 170W/m.k; Thermal Conductivity Vishay 59AJ2390
THERMAL JUMPER, ALUMI NITRIDE, 170W/M.K; Thermal Conductivity:170W/m. K; Conductive Material:Aluminium Nitride; Thickness:0.03"; Thermal Impedance:13°C/W; Dielectric Strength:-; External Length:0.079"; External Width:0.047"

THERMAL JUMPER, ALUMI NITRIDE, 170W/M.K; Thermal Conductivity:170W/m.K; Conductive Material:Aluminium Nitride; Thickness:0.03"; Thermal Impedance:13°C/W; Dielectric Strength:-; External Length:0.079"; External Width:0.047"

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 59AJ2390
Product Name Thermal Jumper, Alumi Nitride, 170W/m.k; Thermal Conductivity Vishay
Thermal Conductivity 170 W/m-K (98.22 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

Thermal Pads - 2457312 - RS Components, Ltd.
RS Components, Ltd.
Thermal Pads
2457312
Specs
Thermal Conductivity 1600 W/m-K (924 BTU-ft/hr-ft²-F)
View Details
Thin Flim, High Thermal Conductivity with 0.05mm Glass Cloth Reinforcement - SARCON ® GHR - Fujipoly® America Corp.
Fujipoly® America Corp.
Thin Flim, High Thermal Conductivity with 0.05mm Glass Cloth Reinforcement
SARCON ® GHR
Specs
Form / Shape Gap Filler, Foam in Place Gasket
Gap Fill 0.0059 to 0.0118 inch (0.1500 to 0.3000 mm)
Industry Electronics; Semiconductors, IC's
View Details
Potting Compound Solutions for PCBAs - Electrolube ® ER2223 High Chemical Epoxy Potting Compound - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
Potting Compound Solutions for PCBAs
Electrolube ® ER2223 High Chemical Epoxy Potting Compound
Specs
Chemical System Epoxy
Industry Automotive; Electronics; Semiconductors, IC's
View Details
Thermal Interface Materials - - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Thermal Interface Materials
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details