Vishay Precision Group Thermal Jumper, Alumi Nitride, 170W/m.k; Thermal Conductivity Vishay THJP0805ABT1

Description
THERMAL JUMPER, ALUMI NITRIDE, 170W/M.K; Thermal Conductivity:170W/m. K; Conductive Material:Aluminium Nitride; Thickness:0.03"; Thermal Impedance:13°C/W; Dielectric Strength:-; External Length:0.079"; External Width:0.047"
  • Thermal Jumper, Alumi Nitride, 170W/m.k; Thermal Conductivity Vishay - 59AJ2390 - Newark, An Avnet Company
    Newark, An Avnet Company
Datasheet
Description
THERMAL JUMPER, ALUMI NITRIDE, 170W/M.K; Thermal Conductivity:170W/m. K; Conductive Material:Aluminium Nitride; Thickness:0.03"; Thermal Impedance:13°C/W; Dielectric Strength:-; External Length:0.079"; External Width:0.047"
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermal Jumper, Alumi Nitride, 170W/m.k; Thermal Conductivity Vishay - 59AJ2390 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Thermal Jumper, Alumi Nitride, 170W/m.k; Thermal Conductivity Vishay
59AJ2390
Thermal Jumper, Alumi Nitride, 170W/m.k; Thermal Conductivity Vishay 59AJ2390
THERMAL JUMPER, ALUMI NITRIDE, 170W/M.K; Thermal Conductivity:170W/m. K; Conductive Material:Aluminium Nitride; Thickness:0.03"; Thermal Impedance:13°C/W; Dielectric Strength:-; External Length:0.079"; External Width:0.047"

THERMAL JUMPER, ALUMI NITRIDE, 170W/M.K; Thermal Conductivity:170W/m.K; Conductive Material:Aluminium Nitride; Thickness:0.03"; Thermal Impedance:13°C/W; Dielectric Strength:-; External Length:0.079"; External Width:0.047"

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 59AJ2390
Product Name Thermal Jumper, Alumi Nitride, 170W/m.k; Thermal Conductivity Vishay
Thermal Conductivity 170 W/m-K (98.22 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

Pedigree® - 40 VTC-40F - ELANTAS North America LLC
ELANTAS North America LLC
Pedigree®
40 VTC-40F
Specs
Type High Dielectric
Cure / Technology Thermoset; Single Component
Form / Shape Liquid
View Details
High-Reliability Thermoplastic Adhesives for Microelectronics - STAYSTIK ® 672 - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
High-Reliability Thermoplastic Adhesives for Microelectronics
STAYSTIK ® 672
Specs
Cure / Technology Thermoplastic / Hot Melt; Thermoset
Industry Electronics; Semiconductors, IC's
View Details
Thermal film for switch-mode power supplies - SC900FG - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Thermal film for switch-mode power supplies
SC900FG
Specs
Chemical System Silicone
Industry Electronics
Use Temperature -58 to 392 F (-50 to 200 C)
View Details
Extremely Compressible Thermal Gap Filler - SARCON® PG45A - Fujipoly® America Corp.
Fujipoly® America Corp.
Extremely Compressible Thermal Gap Filler
SARCON® PG45A
Specs
Form / Shape Putty; Gap Filler, Foam in Place Gasket
Chemical System Silicone
Gap Fill 0.0591 to 0.0984 inch (1.5 to 2.5 mm)
View Details