RES SMD 887 OHM 0.1% 1/4W 1206
Res Thin Film 1206 887 Ohm 0.1% 1/4W ¦25ppm/¦C 0.01% SMD Waffle Pack
887 Ohms ±0.1% 0.25W, 1/4W Chip Resistor 1206 (3216 Metric) Military, Non-Inductive Thin Film
| ODG (Origin Data Global) | ASAP Semiconductor LLC | DigiKey | |
|---|---|---|---|
| Product Category | Chip Resistors | Resistors | Resistors |
| Product Number | D55342E07B887ARWS | D55342E07B887ARWS | 764-D55342E07B887ARWS-ND |
| Product Name | Chip Resistor - Surface Mount | Res Thin Film 1206 887 Ohm 0.1% 1/4W ¦25ppm/¦C 0.01% SMD Waffle Pack | Chip Resistor - Surface Mount |
| Technology / Construction | Thin Film (Chip) | Thin Film (Chip) | Thin Film (Chip) |
| Resistance Range | 887 ohms | 887 ohms | |
| Tolerance | 0.1000 +/- % | 0.1000 to 0.0100 +/- % | 0.1000 +/- % |
| Power Rating | 0.2500 watts | 4 watts | 0.2500 watts |
| Operating Temperature | -55 to 150 C (-67 to 302 F) | -55 to 150 C (-67 to 302 F) |
