Universal Semiconductor, Inc. USC1173

Description
Datasheet
Description
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Universal Semiconductor, Inc.
San Jose, CA, USA
USC1173
USC1173
Datasheet

Technical Specifications

  Universal Semiconductor, Inc.
Product Category Analog-to-Digital Converter (ADC) Chips
Product Number USC1173
Interface Type Parallel
Package Type LCCC; DIP; Die
Production Status Full-Production
Screening Level Commercial; Industrial; Military
Packing Method Bulk
Unlock Full Specs
to access all available technical data

Similar Products

Data Acquisition - Analog to Digital Converters (ADC) - AD674ASE/883B - Lingto Electronic Limited
Rochester Electronics
Data Acquisition - Analog to Digital Converters (ADC)
AD674ASE/883B
Specs
Interface Type Parallel; Parallel
View Details
Analogue to Digital Converters - 1923224P - RS Components, Ltd.
RS Components, Ltd.
Analogue to Digital Converters
1923224P
Specs
Package Type SSOP; SSOP
Resolution 12 bits
ADC Type SAR; SAR
View Details
Isolation, Si894x Isolated Delta-Sigma Modulator for Current Measurement - Si8941BB-IS - Skyworks Solutions, Inc.
Skyworks Solutions, Inc.
Isolation, Si894x Isolated Delta-Sigma Modulator for Current Measurement
Si8941BB-IS
Specs
Package Type NB SOIC8
ADC Type Sigma-Delta
Input Type Differential
View Details
Precision Integrating Analog Processors, Wide Body Package (denoted by a package code of SWC) offers Plug-in Second Source to Users of Telcom TC500 Integrating Dual Slope Front-end Chip - ALD500SWCL - Advanced Linear Devices, Inc.
Advanced Linear Devices, Inc.
Precision Integrating Analog Processors, Wide Body Package (denoted by a package code of SWC) offers Plug-in Second Source to Users of Telcom TC500 Integrating Dual Slope Front-end Chip
ALD500SWCL
Specs
Package Type SOIC; SOIC16
Operating Temperature 0.0 to 70 C (32 to 158 F)
View Details
5 suppliers