TTM Technologies Inc. RF Hybrid Coupler JP503

Description
The JP503 Pico Xinger is a low profile, miniature 3dB hybrid coupler in an easy to use surface mount package designed for W-CDMA and other 3G applications. The JP503 is designed for balanced amplifiers, variable phase shifters and attenuators, LNAs, signal distribution and is an ideal solution for the ever-increasing demands of the wireless industry for smaller printed circuit boards and high performance. Parts have been subjected to rigorous qualification testing and units are 100% tested. They are manufactured using materials with X and Y thermal expansion coefficients compatible with common substrates. Available in both 5 of 6 tin lead (JP503) and 6 of 6 RoHS compliant tin immersion (JP503S).
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Description
The JP503 Pico Xinger is a low profile, miniature 3dB hybrid coupler in an easy to use surface mount package designed for W-CDMA and other 3G applications. The JP503 is designed for balanced amplifiers, variable phase shifters and attenuators, LNAs, signal distribution and is an ideal solution for the ever-increasing demands of the wireless industry for smaller printed circuit boards and high performance. Parts have been subjected to rigorous qualification testing and units are 100% tested. They are manufactured using materials with X and Y thermal expansion coefficients compatible with common substrates. Available in both 5 of 6 tin lead (JP503) and 6 of 6 RoHS compliant tin immersion (JP503S).
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
RF Hybrid Coupler - JP503 - Richardson RFPD
Downers Grove, IL, United States
RF Hybrid Coupler
JP503
RF Hybrid Coupler JP503
The JP503 Pico Xinger is a low profile, miniature 3dB hybrid coupler in an easy to use surface mount package designed for W-CDMA and other 3G applications. The JP503 is designed for balanced amplifiers, variable phase shifters and attenuators, LNAs, signal distribution and is an ideal solution for the ever-increasing demands of the wireless industry for smaller printed circuit boards and high performance. Parts have been subjected to rigorous qualification testing and units are 100% tested. They are manufactured using materials with X and Y thermal expansion coefficients compatible with common substrates. Available in both 5 of 6 tin lead (JP503) and 6 of 6 RoHS compliant tin immersion (JP503S).

The JP503 Pico Xinger is a low profile, miniature 3dB hybrid coupler in an easy to use surface mount package designed for W-CDMA and other 3G applications. The JP503 is designed for balanced amplifiers, variable phase shifters and attenuators, LNAs, signal distribution and is an ideal solution for the ever-increasing demands of the wireless industry for smaller printed circuit boards and high performance. Parts have been subjected to rigorous qualification testing and units are 100% tested. They are manufactured using materials with X and Y thermal expansion coefficients compatible with common substrates. Available in both 5 of 6 tin lead (JP503) and 6 of 6 RoHS compliant tin immersion (JP503S).

Supplier's Site Datasheet

Technical Specifications

  Richardson RFPD
Product Category RF Couplers
Product Number JP503
Product Name RF Hybrid Coupler
Package Type Surface Mount
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