TTM Technologies Inc. RF Hybrid Coupler 1E1304-3

Description
The 1E1304-3 is a low profile 3dB hybrid coupler in an easy to use surface mount package for AMPS, GSM, IDEN and EDGE applications. The 1E1304-3 is ideal for balanced amplifiers and signal distribution and is an ideal solution for the ever increasing demands of the wireless industry for smaller printed circuit boards. Parts have been subjected to rigorous qualification and units are 100% tested. They are manufactured using materials with x and y thermal expansion coefficients compatible with common substrates.
  • RF Hybrid Coupler - 1E1304-3 - Richardson RFPD
    Richardson RFPD
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Description
The 1E1304-3 is a low profile 3dB hybrid coupler in an easy to use surface mount package for AMPS, GSM, IDEN and EDGE applications. The 1E1304-3 is ideal for balanced amplifiers and signal distribution and is an ideal solution for the ever increasing demands of the wireless industry for smaller printed circuit boards. Parts have been subjected to rigorous qualification and units are 100% tested. They are manufactured using materials with x and y thermal expansion coefficients compatible with common substrates.
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Suppliers

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RF Hybrid Coupler - 1E1304-3 - Richardson RFPD
Richardson RFPD
Downers Grove, IL, United States
RF Hybrid Coupler
1E1304-3
RF Hybrid Coupler 1E1304-3
The 1E1304-3 is a low profile 3dB hybrid coupler in an easy to use surface mount package for AMPS, GSM, IDEN and EDGE applications. The 1E1304-3 is ideal for balanced amplifiers and signal distribution and is an ideal solution for the ever increasing demands of the wireless industry for smaller printed circuit boards. Parts have been subjected to rigorous qualification and units are 100% tested. They are manufactured using materials with x and y thermal expansion coefficients compatible with common substrates.

The 1E1304-3 is a low profile 3dB hybrid coupler in an easy to use surface mount package for AMPS, GSM, IDEN and EDGE applications. The 1E1304-3 is ideal for balanced amplifiers and signal distribution and is an ideal solution for the ever increasing demands of the wireless industry for smaller printed circuit boards. Parts have been subjected to rigorous qualification and units are 100% tested. They are manufactured using materials with x and y thermal expansion coefficients compatible with common substrates.

Supplier's Site Datasheet

Technical Specifications

  Richardson RFPD
Product Category RF Couplers
Product Number 1E1304-3
Product Name RF Hybrid Coupler
Package Type Surface Mount
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