Trigon Components, Inc. ECB Series

Description
SERIES ECB DESCRIPTION Chip, General Purpose and High Band IMPEDANCE RANGE 5 to 130 Ohm CURRENT RATING 300 to 600mA FREQUENCY 100MHz PACKAGE SMD 0603 to 1812 FEATURE •High density packaging with a pitch of 2.54mm (0.1 inch) max. is possible. This series requires less space and has greater EMI suppression effects. •Different types with the same shape are available. •Excellent in physical properties, such as terminal strength, flexure strength, soldering resistance and solderability. •Applicable to both flow and reflow soldering. •High impedance cover wide frequency ranges. •L material type can minimize attenuation of the signal waveform due to its sharp impedance characteristics.
Datasheet
Description
SERIES ECB DESCRIPTION Chip, General Purpose and High Band IMPEDANCE RANGE 5 to 130 Ohm CURRENT RATING 300 to 600mA FREQUENCY 100MHz PACKAGE SMD 0603 to 1812 FEATURE •High density packaging with a pitch of 2.54mm (0.1 inch) max. is possible. This series requires less space and has greater EMI suppression effects. •Different types with the same shape are available. •Excellent in physical properties, such as terminal strength, flexure strength, soldering resistance and solderability. •Applicable to both flow and reflow soldering. •High impedance cover wide frequency ranges. •L material type can minimize attenuation of the signal waveform due to its sharp impedance characteristics.
Datasheet

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SERIES ECB DESCRIPTION Chip, General Purpose and High Band IMPEDANCE RANGE 5 to 130 Ohm CURRENT RATING 300 to 600mA FREQUENCY 100MHz PACKAGE SMD 0603 to 1812 FEATURE •High density packaging with a pitch of 2.54mm (0.1 inch) max. is possible. This series requires less space and has greater EMI suppression effects. •Different types with the same shape are available. •Excellent in physical properties, such as terminal strength, flexure strength, soldering resistance and solderability. •Applicable to both flow and reflow soldering. •High impedance cover wide frequency ranges. •L material type can minimize attenuation of the signal waveform due to its sharp impedance characteristics.
SERIESECB
DESCRIPTIONChip, General Purpose and High Band
IMPEDANCE RANGE5 to 130 Ohm
CURRENT RATING300 to 600mA
FREQUENCY100MHz
PACKAGESMD 0603 to 1812
FEATURE•High density packaging with a pitch of 2.54mm (0.1 inch) max. is possible. This series requires less space and has greater EMI suppression effects.
•Different types with the same shape are available.
•Excellent in physical properties, such as terminal strength, flexure strength, soldering resistance and solderability.
•Applicable to both flow and reflow soldering.
•High impedance cover wide frequency ranges.
•L material type can minimize attenuation of the signal waveform due to its sharp impedance characteristics.
Supplier's Site Datasheet

Technical Specifications

  Trigon Components, Inc.
Product Category Ferrite Beads
Product Number ECB Series
Technology Multilayer
Impedance 5 to 130 ohms
Rated DC Current 300 to 600 milliamps
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