Bostik, Inc. Bostik H2900 Hot Melt Adhesive Amber 35 lb Case 30617350

Description
Bostik H2900 Hot Melt Adhesive Amber is a styrenic copolymer based formulation with excellent specific adhesion to polyethylene and nonwoven substrates. 35 lb Case.
Request a Quote Datasheet
Description
Bostik H2900 Hot Melt Adhesive Amber is a styrenic copolymer based formulation with excellent specific adhesion to polyethylene and nonwoven substrates. 35 lb Case.
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Bostik H2900 Hot Melt Adhesive Amber 35 lb Case - H2900-CEX - Ellsworth Adhesives
Germantown, WI, USA
Bostik H2900 Hot Melt Adhesive Amber 35 lb Case
H2900-CEX
Bostik H2900 Hot Melt Adhesive Amber 35 lb Case H2900-CEX
Bostik H2900 Hot Melt Adhesive Amber is a styrenic copolymer based formulation with excellent specific adhesion to polyethylene and nonwoven substrates. 35 lb Case.

Bostik H2900 Hot Melt Adhesive Amber is a styrenic copolymer based formulation with excellent specific adhesion to polyethylene and nonwoven substrates. 35 lb Case.

Supplier's Site Datasheet

Technical Specifications

  Ellsworth Adhesives
Product Category Industrial Adhesives
Product Number H2900-CEX
Product Name Bostik H2900 Hot Melt Adhesive Amber 35 lb Case
Cure / Technology Thermoplastic / Hot Melt; Single Component
Unlock Full Specs
to access all available technical data

Similar Products

Formulations - Applications - Bonding - Tuffbond 42121 - 342121AB22 - Hernon Manufacturing, Inc.
Specs
Chemical System Ceramic; Epoxy
Features Encapsulant, Potting Compound
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Magna-Tac® M611 -  - Beacon Adhesives, Inc.
Beacon Adhesives, Inc.
Specs
Substrate Compatibility Plastic
View Details
Heat Transfer Compound - T-99 - Thermon, Inc
Specs
Cure / Technology Single Component
Features Thermally Conductive
Use Temperature 32 to 2200 F (0 to 1204 C)
View Details
Adhesives -  - Dexmet® Corporation, a part of PPG’s engineered materials division
Dexmet® Corporation, a part of PPG’s engineered materials division
Specs
Cure / Technology Two Component  
Chemical System Epoxy; Silicone
View Details