Total Plastics, Inc. Epoxy Adhesive Kit

Description
A kit consisting of two components, epoxy resin and hardener. Note: For use with STRONGWELL Fiberglass products. Available Sizes Kit (E502 Quart) Kit (E504 1/2 Gallon)
  • Epoxy Adhesive Kit - Total Plastics, Inc.
    Total Plastics, Inc.
Description
A kit consisting of two components, epoxy resin and hardener. Note: For use with STRONGWELL Fiberglass products. Available Sizes Kit (E502 Quart) Kit (E504 1/2 Gallon)

Suppliers

Company
Product
Description
Supplier Links
Epoxy Adhesive Kit - - Total Plastics, Inc.
Total Plastics, Inc.
Kalamazoo, MI, USA
Epoxy Adhesive Kit
Epoxy Adhesive Kit
A kit consisting of two components, epoxy resin and hardener. Note: For use with STRONGWELL Fiberglass products. Available Sizes Kit (E502 Quart) Kit (E504 1/2 Gallon)

A kit consisting of two components, epoxy resin and hardener. Note: For use with STRONGWELL Fiberglass products.

Available Sizes

Kit (E502 Quart)
Kit (E504 1/2 Gallon)

Supplier's Site

Technical Specifications

  Total Plastics, Inc.
Product Category Industrial Adhesives
Product Name Epoxy Adhesive Kit
Cure / Technology Two Component  
Unlock Full Specs
to access all available technical data

Similar Products

Dymax Ultra Light-Weld® 3030 UV Curing Adhesive Clear 30 mL MR Syringe - 3030 30ML MR SYRINGE - Ellsworth Adhesives
Dymax
Dymax Ultra Light-Weld® 3030 UV Curing Adhesive Clear 30 mL MR Syringe
3030/30SYMR
Specs
Cure / Technology Single Component
Substrate Compatibility Plastic
Viscosity 300 cP
View Details
One Part, Toughened Epoxy for Specialty Dam-and-Fill Encapsulation - Supreme 3HTND-2DM - Master Bond, Inc.
Master Bond, Inc.
One Part, Toughened Epoxy for Specialty Dam-and-Fill Encapsulation
Supreme 3HTND-2DM
Specs
Cure / Technology Thermoset; Single Component
Chemical System Epoxy
Composition Unfilled
View Details
High-Reliability Thermoplastic Adhesives for Microelectronics - STAYSTIK ® 336T - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
High-Reliability Thermoplastic Adhesives for Microelectronics
STAYSTIK ® 336T
Specs
Cure / Technology Thermoplastic / Hot Melt
Industry Aerospace; Electronics; Sanitary; Semiconductors, IC's
View Details
High thermal conductivity carbon fiber heat sink soft thermal pad thermal gap filler for electronic devices - CSF30 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
High thermal conductivity carbon fiber heat sink soft thermal pad thermal gap filler for electronic devices
CSF30
Specs
Features Thermally Conductive
Industry Electronics
Use Temperature ? to 320 F (? to 160 C)
View Details