Techsil Limited ThreeBond TB2273D Magnet Bonding Epoxy 310ml TBEP19021

Description
TB2273D from ThreeBond is a thixotropic single component epoxy resin adhesive that has high temperature curing capabilities suitable for instant induction curing with HF-coils. After curing the hardened material has excellent electrical and mechanical properties such as good chemical resistance, high strength and good adhesion. Recommended for general bonding, adhesion of yokes and magnets, sealing electric components, fixing of connection wires, filing and adhesion of laminar gaps and encapsulation of relays. Off white in colour, cures to a 86 Shore D material. Product Benefits Curing at high temperatures Easy to apply with various dispensing systems High strength and adhesion Excellent heat resistance and electrical insulation Lead time: 45 days
Datasheet
Description
TB2273D from ThreeBond is a thixotropic single component epoxy resin adhesive that has high temperature curing capabilities suitable for instant induction curing with HF-coils. After curing the hardened material has excellent electrical and mechanical properties such as good chemical resistance, high strength and good adhesion. Recommended for general bonding, adhesion of yokes and magnets, sealing electric components, fixing of connection wires, filing and adhesion of laminar gaps and encapsulation of relays. Off white in colour, cures to a 86 Shore D material. Product Benefits Curing at high temperatures Easy to apply with various dispensing systems High strength and adhesion Excellent heat resistance and electrical insulation Lead time: 45 days
Datasheet

Suppliers

Company
Product
Description
Supplier Links
ThreeBond TB2273D Magnet Bonding Epoxy 310ml - TBEP19021 - Techsil Limited
Bidford on Avon, United Kingdom
ThreeBond TB2273D Magnet Bonding Epoxy 310ml
TBEP19021
ThreeBond TB2273D Magnet Bonding Epoxy 310ml TBEP19021
TB2273D from ThreeBond is a thixotropic single component epoxy resin adhesive that has high temperature curing capabilities suitable for instant induction curing with HF-coils. After curing the hardened material has excellent electrical and mechanical properties such as good chemical resistance, high strength and good adhesion. Recommended for general bonding, adhesion of yokes and magnets, sealing electric components, fixing of connection wires, filing and adhesion of laminar gaps and encapsulation of relays. Off white in colour, cures to a 86 Shore D material. Product Benefits Curing at high temperatures Easy to apply with various dispensing systems High strength and adhesion Excellent heat resistance and electrical insulation Lead time: 45 days

TB2273D from ThreeBond is a thixotropic single component epoxy resin adhesive that has high temperature curing capabilities suitable for instant induction curing with HF-coils. After curing the hardened material has excellent electrical and mechanical properties such as good chemical resistance, high strength and good adhesion.

Recommended for general bonding, adhesion of yokes and magnets, sealing electric components, fixing of connection wires, filing and adhesion of laminar gaps and encapsulation of relays. Off white in colour, cures to a 86 Shore D material.

Product Benefits

  • Curing at high temperatures
  • Easy to apply with various dispensing systems
  • High strength and adhesion
  • Excellent heat resistance and electrical insulation

Lead time: 45 days

Supplier's Site Datasheet

Technical Specifications

  Techsil Limited
Product Category Industrial Sealants
Product Number TBEP19021
Product Name ThreeBond TB2273D Magnet Bonding Epoxy 310ml
Cure / Technology Thermoset
Unlock Full Specs
to access all available technical data

Similar Products

KM 2740 Series -  - Beacon Adhesives, Inc.
Beacon Adhesives, Inc.
View Details
Optically Clear, Low Viscosity, Two Component Epoxy - EP30 - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  
Type / Form Liquid
Substrate Compatibility Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
View Details
Epoxylite® - E 5403 Hi Temp Epoxy Kit - ELANTAS North America LLC
Specs
Cure / Technology Thermoset; Two Component  
Type / Form Grease, Paste
Substrate Compatibility Dissimilar Substrates
View Details
C-SHIELD RF Conductive Caulking Compound and Sealer -  - Dexmet® Corporation, a part of PPG’s engineered materials division
Dexmet® Corporation, a part of PPG’s engineered materials division
Specs
Type / Form Liquid
Features Caulk, Grout; Electrically Conductive
View Details