Techsil Limited Panacol Elecolit® 323 Silver Filled Epoxy 28gm PNEL00002

Description
Elecolit® 323 is a silver filled two part epoxy adhesive specially developed for bonding open chip components. This semiconducting grade has passed the autoclave test (1000h) and is suitable for use on semi conductors, it has no effect on bond wire adhesion. It can cured at either room temperature or thermally with the exposure of heat, further details on curing can be found on the TDS. Product Benefits Operating Temp Range: -60°C to +175°C Shore Hardness: 72 Shore D Thermal Conductivity: 3.5 W/mK Easy to use mix ratio - 1:1 by weight Silver Filled Supplied in a 28gm Kit Size
  • Panacol Elecolit® 323 Silver Filled Epoxy 28gm - PNEL00002 - Techsil Limited
    Techsil Limited
Datasheet
Description
Elecolit® 323 is a silver filled two part epoxy adhesive specially developed for bonding open chip components. This semiconducting grade has passed the autoclave test (1000h) and is suitable for use on semi conductors, it has no effect on bond wire adhesion. It can cured at either room temperature or thermally with the exposure of heat, further details on curing can be found on the TDS. Product Benefits Operating Temp Range: -60°C to +175°C Shore Hardness: 72 Shore D Thermal Conductivity: 3.5 W/mK Easy to use mix ratio - 1:1 by weight Silver Filled Supplied in a 28gm Kit Size
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Panacol Elecolit® 323 Silver Filled Epoxy 28gm - PNEL00002 - Techsil Limited
Techsil Limited
Bidford on Avon, United Kingdom
Panacol Elecolit® 323 Silver Filled Epoxy 28gm
PNEL00002
Panacol Elecolit® 323 Silver Filled Epoxy 28gm PNEL00002
Elecolit® 323 is a silver filled two part epoxy adhesive specially developed for bonding open chip components. This semiconducting grade has passed the autoclave test (1000h) and is suitable for use on semi conductors, it has no effect on bond wire adhesion. It can cured at either room temperature or thermally with the exposure of heat, further details on curing can be found on the TDS. Product Benefits Operating Temp Range: -60°C to +175°C Shore Hardness: 72 Shore D Thermal Conductivity: 3.5 W/mK Easy to use mix ratio - 1:1 by weight Silver Filled Supplied in a 28gm Kit Size

Elecolit® 323 is a silver filled two part epoxy adhesive specially developed for bonding open chip components.

This semiconducting grade has passed the autoclave test (1000h) and is suitable for use on semi conductors, it has no effect on bond wire adhesion. It can cured at either room temperature or thermally with the exposure of heat, further details on curing can be found on the TDS.

Product Benefits

  • Operating Temp Range: -60°C to +175°C
  • Shore Hardness: 72 Shore D
  • Thermal Conductivity: 3.5 W/mK
  • Easy to use mix ratio - 1:1 by weight
  • Silver Filled

Supplied in a 28gm Kit Size

Supplier's Site Datasheet

Technical Specifications

  Techsil Limited
Product Category Industrial Sealants
Product Number PNEL00002
Product Name Panacol Elecolit® 323 Silver Filled Epoxy 28gm
Cure / Technology Thermoset
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