- Trained on our vast library of engineering resources.

Techsil Limited Momentive TSE3331 Electronic Potting Silicone 2kg MOSI17151

Description
TSE3331 is a two part, heat curing silicone from Momentive Performance Materials designed for potting and encapsulation where flammability and/or thermal conductivity is of concern. It provides excellent flame retardant properties and very stable dielectric properties over a broad range of operating temperatures. In addition, this grade also offers superior thermal conductivity properties when compared to other conventional silicone encapsulants. Product Benefits Convenient 1:1 mixing ratio Solvent free Low shrinkage Reversion resistant and hydrolytically stable Self-bonding, excellent adhesion to many substrates Excellent thermal conductivity properties Technical Properties Uncured Consistency:Easily pourable Colour: Dark Grey Cured Shore Hardness: 60 Shore A Dielectric Strength: 26kv/ mm Operating Temperature: -55°C to +200°C Flammability Classification: UL94V-0
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Momentive TSE3331 Electronic Potting Silicone 2kg - MOSI17151 - Techsil Limited
Bidford on Avon, United Kingdom
Momentive TSE3331 Electronic Potting Silicone 2kg
MOSI17151
Momentive TSE3331 Electronic Potting Silicone 2kg MOSI17151
TSE3331 is a two part, heat curing silicone from Momentive Performance Materials designed for potting and encapsulation where flammability and/or thermal conductivity is of concern. It provides excellent flame retardant properties and very stable dielectric properties over a broad range of operating temperatures. In addition, this grade also offers superior thermal conductivity properties when compared to other conventional silicone encapsulants. Product Benefits Convenient 1:1 mixing ratio Solvent free Low shrinkage Reversion resistant and hydrolytically stable Self-bonding, excellent adhesion to many substrates Excellent thermal conductivity properties Technical Properties Uncured Consistency:Easily pourable Colour: Dark Grey Cured Shore Hardness: 60 Shore A Dielectric Strength: 26kv/ mm Operating Temperature: -55°C to +200°C Flammability Classification: UL94V-0

TSE3331 is a two part, heat curing silicone from Momentive Performance Materials designed for potting and encapsulation where flammability and/or thermal conductivity is of concern. It provides excellent flame retardant properties and very stable dielectric properties over a broad range of operating temperatures. In addition, this grade also offers superior thermal conductivity properties when compared to other conventional silicone encapsulants.

Product Benefits

  • Convenient 1:1 mixing ratio
  • Solvent free
  • Low shrinkage
  • Reversion resistant and hydrolytically stable
  • Self-bonding, excellent adhesion to many substrates
  • Excellent thermal conductivity properties

Technical Properties

  • Uncured Consistency:Easily pourable
  • Colour: Dark Grey
  • Cured Shore Hardness: 60 Shore A
  • Dielectric Strength: 26kv/ mm
  • Operating Temperature: -55°C to +200°C

Flammability Classification: UL94V-0

Supplier's Site Datasheet

Technical Specifications

  Techsil Limited
Product Category Rubber Adhesives and Sealants
Product Number MOSI17151
Product Name Momentive TSE3331 Electronic Potting Silicone 2kg
Chemical System Silicone
Unlock Full Specs
to access all available technical data

Similar Products

ALPHA ® HiTech CU11-3127 Underfill -  - MacDermid Alpha Electronics Solutions
Specs
Industry Semiconductors, IC's
View Details
Formulations - Applications - Bonding - React 766 - 766PT - Hernon Manufacturing, Inc.
Specs
Cure / Technology Single Component
Chemical System Acrylic
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Two component, medical grade silicone for bonding and sealing - Mastersil 323Med - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Substrate Compatibility Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
Chemical System Silicone
View Details
 - 7074626 - RS Components, Ltd.
RS Components, Ltd.
Specs
Form / Shape Pad
Use Temperature -40 to 392 F (-40 to 200 C)
Thermal Conductivity 1.95 W/m-K (1.13 BTU-ft/hr-ft²-F)
View Details