Liquid photoimageable solder mask for rigid circuit panels
Excellent cosmetic appearance, with a range of colors and surface finishes
Wide process latitude enabling fine image reproduction with clean PTH/via development
Resolution capability below 2 mils for ultra fine pitch solder dams
Superior resistance to all plated surface finishing processes including ENIG, immersion tin and immersion silver
UL File #E83246, rated 94 V-0 with soldering limits of 20 seconds @ 288°C
Meets or exceeds IPC SM 840C, Bellcore TR-NWT-000078, and MIL P55110D specifications
Colors – Green, Blue, White, Red, Black, Clear
Liquid photoimageable solder mask for rigid circuit panels
- Excellent cosmetic appearance, with a range of colors and surface finishes
- Wide process latitude enabling fine image reproduction with clean PTH/via development
- Resolution capability below 2 mils for ultra fine pitch solder dams
- Superior resistance to all plated surface finishing processes including ENIG, immersion tin and immersion silver
- UL File #E83246, rated 94 V-0 with soldering limits of 20 seconds @ 288°C
- Meets or exceeds IPC SM 840C, Bellcore TR-NWT-000078, and MIL P55110D specifications
- Colors – Green, Blue, White, Red, Black, Clear
