Technic CU128 provides better throwing power with higher current density when compared to competitive processes. It is chemistry unique to Technic that provides superior control of grain structure and suppression of plating deposit in HCD areas. This translates into no burning, excellent distribution, and unsurpassed throwing power with DC current. To the fabricator, this means higher through put and easier process control.
| Technic, Inc. | |
|---|---|
| Product Category | Plating and Anodizing Equipment |
| Product Number | Technic CU128 |
| Product Name | Vertical Copper Plating System |
| Process / Technology | Electroplating |
