Low cost wet bench design for R&D and low volume applications.
Same basic cell and wafer holder design as used on our highly successful SEMCON 1500 and 2000 series.
Tool features a single plating cell and dragout rinse cell.
Plating and electroforming of wafers or discrete parts, slivers, etc., up to 200mm.
Tool is self-contained, constructed of white polypropylene with a clear PVC process cover designed to meet class 1000 clean room specification.
Plating cell components include heating temperature control, low level safety device, pump and filter, DC power supply, and wafer holder.
Technic, Inc.
Done
Description
Low cost wet bench design for R&D and low volume applications.
Same basic cell and wafer holder design as used on our highly successful SEMCON 1500 and 2000 series.
Tool features a single plating cell and dragout rinse cell.
Plating and electroforming of wafers or discrete parts, slivers, etc., up to 200mm.
Tool is self-contained, constructed of white polypropylene with a clear PVC process cover designed to meet class 1000 clean room specification.
Plating cell components include heating temperature control, low level safety device, pump and filter, DC power supply, and wafer holder.
Low cost wet bench design for R&D and low volume applications.
Same basic cell and wafer holder design as used on our highly successful SEMCON 1500 and 2000 series.
Tool features a single plating cell and dragout rinse cell.
Plating and electroforming of wafers or discrete parts, slivers, etc., up to 200mm.
Tool is self-contained, constructed of white polypropylene with a clear PVC process cover designed to meet class 1000 clean room specification.
Plating cell components include heating temperature control, low level safety device, pump and filter, DC power supply, and wafer holder.
Low cost wet bench design for R&D and low volume applications.
Same basic cell and wafer holder design as used on our highly successful SEMCON 1500 and 2000 series.
Tool features a single plating cell and dragout rinse cell.
Plating and electroforming of wafers or discrete parts, slivers, etc., up to 200mm.
Tool is self-contained, constructed of white polypropylene with a clear PVC process cover designed to meet class 1000 clean room specification.
Plating cell components include heating temperature control, low level safety device, pump and filter, DC power supply, and wafer holder.
