IKo™ Jr. is a practical benchtop tool with the smallest footprint on the market capable of efficiently electroplating 4” wafers with just 1 gallon of solution.
Designed for fast electroplating of high-resolution interconnects and fine metallic features on wafers and substrates.
Contamination Resistant IKo™ Jr. is fabricated with PVC and polypropylene and a minimum of metal parts to avoid potential contamination of electroplating solutions.
Reliable Parts and Easy Assembly Metal features are stainless and titanium. All parts can be easily disassembled for maintenance.
The unit is made up of two sections:
1. Electroplating Section Conveniently accessible while preparing wafers for plating.
2. Power Section Rolls over the Electroplating Section for processing. IKo’s arrangement of wafer holder, reciprocating anode, reverse pulse rectifier and pump ensure surpassing performance:
Wafer holder, ergonomically designed for easy processing and handling. IKo™ can accommodate various wafer sizes. A full-circle, elastic electric contact provides uniform current distribution. Result: uniform thickness features across the wafer.
Reciprocating anode, a proprietary feature that provides an efficient exchange of matter and uniform electric field distribution.
Programmable Reverse-pulse Rectifier, contributes to equipment versatility. Reverse-pulse current during processing efficiently controls plating thickness distribution along the Z-axis.
Fan-out Pump with constant filtration (regardless of fine filter medium). Provides a constant flow of high-quality bulk solution.
IKo™ Jr. is a practical benchtop tool with the smallest footprint on the market capable of efficiently electroplating 4” wafers with just 1 gallon of solution.
Designed for fast electroplating of high-resolution interconnects and fine metallic features on wafers and substrates.
Contamination Resistant
IKo™ Jr. is fabricated with PVC and polypropylene and a minimum of metal parts to avoid potential contamination of electroplating solutions.
Reliable Parts and Easy Assembly
Metal features are stainless and titanium. All parts can be easily disassembled for maintenance.
The unit is made up of two sections:
1. Electroplating Section
Conveniently accessible while preparing wafers for plating.
2. Power Section
Rolls over the Electroplating Section for processing. IKo’s arrangement of wafer holder, reciprocating anode, reverse pulse rectifier and pump ensure surpassing performance:
- Wafer holder, ergonomically designed for easy processing and handling. IKo™ can accommodate various wafer sizes. A full-circle, elastic electric contact provides uniform current distribution. Result: uniform thickness features across the wafer.
- Reciprocating anode, a proprietary feature that provides an efficient exchange of matter and uniform electric field distribution.
- Programmable Reverse-pulse Rectifier, contributes to equipment versatility. Reverse-pulse current during processing efficiently controls plating thickness distribution along the Z-axis.
- Fan-out Pump with constant filtration (regardless of fine filter medium). Provides a constant flow of high-quality bulk solution.
