Technic, Inc. Continuous PCB Wet Process Equipment MP100

Description
Technic has long been pioneer in the ongoing development of printed circuit board wet processing equipment and chemistry. Our ongoing commitment to application research and in-house product development has enabled us to continuously offer our customers the most advanced technology available for both chemistry and equipment. Applications Base and precious metals plating Copper flash plate, panel plate, pattern plate Developing, etching, stripping Chemical cleaning MP100 Advantages Edge-to-edge processing forms a continuous flow through the plating cell eliminating edge effects and creating a highly consistent panel to panel distribution for surface and via plating. The MP100 is capable of handling panel thickness ranging from framed 25 micron VM sheets to 7.6mm multilayer panels with many key advantages: Repeatable performance with high Cpk Thickness uniformity to +/-5% Current density to 10ASD Homogeneous plating with no layer separation Eliminates plating voids and pits resulting from trapped gases
  • Continuous PCB Wet Process Equipment - MP100 - Technic, Inc.
    Technic, Inc.
Description
Technic has long been pioneer in the ongoing development of printed circuit board wet processing equipment and chemistry. Our ongoing commitment to application research and in-house product development has enabled us to continuously offer our customers the most advanced technology available for both chemistry and equipment. Applications Base and precious metals plating Copper flash plate, panel plate, pattern plate Developing, etching, stripping Chemical cleaning MP100 Advantages Edge-to-edge processing forms a continuous flow through the plating cell eliminating edge effects and creating a highly consistent panel to panel distribution for surface and via plating. The MP100 is capable of handling panel thickness ranging from framed 25 micron VM sheets to 7.6mm multilayer panels with many key advantages: Repeatable performance with high Cpk Thickness uniformity to +/-5% Current density to 10ASD Homogeneous plating with no layer separation Eliminates plating voids and pits resulting from trapped gases

Suppliers

Company
Product
Description
Supplier Links
Continuous PCB Wet Process Equipment - MP100 - Technic, Inc.
Technic, Inc.
Cranston, RI, USA
Continuous PCB Wet Process Equipment
MP100
Continuous PCB Wet Process Equipment MP100
Technic has long been pioneer in the ongoing development of printed circuit board wet processing equipment and chemistry. Our ongoing commitment to application research and in-house product development has enabled us to continuously offer our customers the most advanced technology available for both chemistry and equipment. Applications Base and precious metals plating Copper flash plate, panel plate, pattern plate Developing, etching, stripping Chemical cleaning MP100 Advantages Edge-to-edge processing forms a continuous flow through the plating cell eliminating edge effects and creating a highly consistent panel to panel distribution for surface and via plating. The MP100 is capable of handling panel thickness ranging from framed 25 micron VM sheets to 7.6mm multilayer panels with many key advantages: Repeatable performance with high Cpk Thickness uniformity to +/-5% Current density to 10ASD Homogeneous plating with no layer separation Eliminates plating voids and pits resulting from trapped gases

Technic has long been pioneer in the ongoing development of printed circuit board wet processing equipment and chemistry. Our ongoing commitment to application research and in-house product development has enabled us to continuously offer our customers the most advanced technology available for both chemistry and equipment.

Applications

  • Base and precious metals plating
  • Copper flash plate, panel plate, pattern plate
  • Developing, etching, stripping
  • Chemical cleaning

MP100 Advantages

Edge-to-edge processing forms a continuous flow through the plating cell eliminating edge effects and creating a highly consistent panel to panel distribution for surface and via plating. The MP100 is capable of handling panel thickness ranging from framed 25 micron VM sheets to 7.6mm multilayer panels with many key advantages:

  • Repeatable performance with high Cpk
  • Thickness uniformity to +/-5%
  • Current density to 10ASD
  • Homogeneous plating with no layer separation
  • Eliminates plating voids and pits resulting from trapped gases
Supplier's Site

Technical Specifications

  Technic, Inc.
Product Category Semiconductor Wet Process Equipment
Product Number MP100
Product Name Continuous PCB Wet Process Equipment
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