Configuration Features Compatible With Wire & Cable Type : Discrete Wire
Contact Features Contact Base Material : Phosphor Bronze Contact Current Rating (Max) (AMP) : 2 Contact Mating Area Plating Material : Gold (Au), Gold Flash over Palladium Nickel Contact Mating Area Plating Material Thickness : .381 MICM [15 MICIN ] Contact Type : Socket Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Gold Flash
Dimensions Accepts Conductor Width : 1.27 MM , 1.82 MM [.05 INCH ] Compatible Insulation Diameter Range : 1.02 - 1.42 MM [.04 - .056 INCH ] Wire Size (MMSQ) : .2 - .4 Wire Size (AWG) : 24 - 22
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Bag
Termination Features Product Terminates To : Wire & Cable Termination Method to Wire & Cable : Crimp
Usage Conditions Operating Temperature Range : -65 - 105 DEGC [-85 - 221 DEGF ]
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Description
Configuration Features Compatible With Wire & Cable Type : Discrete Wire
Contact Features Contact Base Material : Phosphor Bronze Contact Current Rating (Max) (AMP) : 2 Contact Mating Area Plating Material : Gold (Au), Gold Flash over Palladium Nickel Contact Mating Area Plating Material Thickness : .381 MICM [15 MICIN ] Contact Type : Socket Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Gold Flash
Dimensions Accepts Conductor Width : 1.27 MM , 1.82 MM [.05 INCH ] Compatible Insulation Diameter Range : 1.02 - 1.42 MM [.04 - .056 INCH ] Wire Size (MMSQ) : .2 - .4 Wire Size (AWG) : 24 - 22
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Bag
Termination Features Product Terminates To : Wire & Cable Termination Method to Wire & Cable : Crimp
Usage Conditions Operating Temperature Range : -65 - 105 DEGC [-85 - 221 DEGF ]
Configuration Features Compatible With Wire & Cable Type : Discrete Wire
Contact Features Contact Base Material : Phosphor Bronze Contact Current Rating (Max) (AMP) : 2 Contact Mating Area Plating Material : Gold (Au), Gold Flash over Palladium Nickel Contact Mating Area Plating Material Thickness : .381 MICM [15 MICIN ] Contact Type : Socket Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Gold Flash
Dimensions Accepts Conductor Width : 1.27 MM , 1.82 MM [.05 INCH ] Compatible Insulation Diameter Range : 1.02 - 1.42 MM [.04 - .056 INCH ] Wire Size (MMSQ) : .2 - .4 Wire Size (AWG) : 24 - 22
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Bag
Termination Features Product Terminates To : Wire & Cable Termination Method to Wire & Cable : Crimp
Usage Conditions Operating Temperature Range : -65 - 105 DEGC [-85 - 221 DEGF ]
Configuration Features
Compatible With Wire & Cable Type : Discrete Wire
Contact Features
Contact Base Material : Phosphor Bronze
Contact Current Rating (Max) (AMP) : 2
Contact Mating Area Plating Material : Gold (Au), Gold Flash over Palladium Nickel
Contact Mating Area Plating Material Thickness : .381 MICM [15 MICIN ]
Contact Type : Socket
Contact Underplating Material : Nickel
PCB Contact Termination Area Plating Material : Gold Flash
Dimensions
Accepts Conductor Width : 1.27 MM , 1.82 MM [.05 INCH ]
Compatible Insulation Diameter Range : 1.02 - 1.42 MM [.04 - .056 INCH ]
Wire Size (MMSQ) : .2 - .4
Wire Size (AWG) : 24 - 22
Operation/Application
Circuit Application : Signal
Packaging Features
Packaging Method : Bag
Termination Features
Product Terminates To : Wire & Cable
Termination Method to Wire & Cable : Crimp
Usage Conditions
Operating Temperature Range : -65 - 105 DEGC [-85 - 221 DEGF ]
