TE Connectivity
Connector Contacts
86561-4
Description
Configuration Features Compatible With Wire & Cable Type : Discrete Wire
Contact Features Contact Base Material : Phosphor Bronze Contact Current Rating (Max) (AMP) : 2 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness (MICIN) : 30 Contact Type : Pin Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Gold Flash
Dimensions Accepts Conductor Width (MM) : 1.27, 2.33 Compatible Insulation Diameter Range : 1.02 - 1.42 MM [.04 - .056 INCH ] Wire Size (MMSQ) : .12 - .4 Wire Size (AWG) : 26 - 22
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Loose Piece
Termination Features Product Terminates To : Wire & Cable Termination Method to Wire & Cable : Insulation Displacement (IDC)
Usage Conditions Operating Temperature Range : -65 - 105 DEGC [-85 - 221 DEGF ]
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Description
Configuration Features Compatible With Wire & Cable Type : Discrete Wire
Contact Features Contact Base Material : Phosphor Bronze Contact Current Rating (Max) (AMP) : 2 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness (MICIN) : 30 Contact Type : Pin Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Gold Flash
Dimensions Accepts Conductor Width (MM) : 1.27, 2.33 Compatible Insulation Diameter Range : 1.02 - 1.42 MM [.04 - .056 INCH ] Wire Size (MMSQ) : .12 - .4 Wire Size (AWG) : 26 - 22
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Loose Piece
Termination Features Product Terminates To : Wire & Cable Termination Method to Wire & Cable : Insulation Displacement (IDC)
Usage Conditions Operating Temperature Range : -65 - 105 DEGC [-85 - 221 DEGF ]
Request a Quote
Email Supplier
Suppliers
Configuration Features Compatible With Wire & Cable Type : Discrete Wire
Contact Features Contact Base Material : Phosphor Bronze Contact Current Rating (Max) (AMP) : 2 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness (MICIN) : 30 Contact Type : Pin Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Gold Flash
Dimensions Accepts Conductor Width (MM) : 1.27, 2.33 Compatible Insulation Diameter Range : 1.02 - 1.42 MM [.04 - .056 INCH ] Wire Size (MMSQ) : .12 - .4 Wire Size (AWG) : 26 - 22
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Loose Piece
Termination Features Product Terminates To : Wire & Cable Termination Method to Wire & Cable : Insulation Displacement (IDC)
Usage Conditions Operating Temperature Range : -65 - 105 DEGC [-85 - 221 DEGF ]
Configuration Features
- Compatible With Wire & Cable Type : Discrete Wire
Contact Features
- Contact Base Material : Phosphor Bronze
- Contact Current Rating (Max) (AMP) : 2
- Contact Mating Area Plating Material : Gold (Au)
- Contact Mating Area Plating Material Thickness (MICIN) : 30
- Contact Type : Pin
- Contact Underplating Material : Nickel
- PCB Contact Termination Area Plating Material : Gold Flash
Dimensions
- Accepts Conductor Width (MM) : 1.27, 2.33
- Compatible Insulation Diameter Range : 1.02 - 1.42 MM [.04 - .056 INCH ]
- Wire Size (MMSQ) : .12 - .4
- Wire Size (AWG) : 26 - 22
Operation/Application
- Circuit Application : Signal
Packaging Features
- Packaging Method : Loose Piece
Termination Features
- Product Terminates To : Wire & Cable
- Termination Method to Wire & Cable : Insulation Displacement (IDC)
Usage Conditions
- Operating Temperature Range : -65 - 105 DEGC [-85 - 221 DEGF ]
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Technical Specifications
|
Product Category
|
Wire Terminals |
|
Product Number
|
86561-4 |
|
Product Name
|
Connector Contacts |
|
Features
|
RoHS
|
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