Contact Features Contact Base Material : Brass Contact Current Rating (Max) (AMP) : 3 Contact Mating Area Plating Material : Tin Contact Mating Area Plating Material Finish : Bright Contact Mating Area Plating Material Thickness : 2.54 - 5.08 MICM [100 - 200 MICIN ] Contact Orientation : Right Angle Contact Type : Pin Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Tin
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Reel Packaging Quantity : 2500
Termination Features Product Terminates To : Printed Circuit Board
Usage Conditions Operating Temperature Range : -55 - 125 DEGC [-67 - 257 DEGF ]
TE Connectivity
Done
Request a Quote
Email Supplier
Description
Contact Features Contact Base Material : Brass Contact Current Rating (Max) (AMP) : 3 Contact Mating Area Plating Material : Tin Contact Mating Area Plating Material Finish : Bright Contact Mating Area Plating Material Thickness : 2.54 - 5.08 MICM [100 - 200 MICIN ] Contact Orientation : Right Angle Contact Type : Pin Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Tin
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Reel Packaging Quantity : 2500
Termination Features Product Terminates To : Printed Circuit Board
Usage Conditions Operating Temperature Range : -55 - 125 DEGC [-67 - 257 DEGF ]
Contact Features Contact Base Material : Brass Contact Current Rating (Max) (AMP) : 3 Contact Mating Area Plating Material : Tin Contact Mating Area Plating Material Finish : Bright Contact Mating Area Plating Material Thickness : 2.54 - 5.08 MICM [100 - 200 MICIN ] Contact Orientation : Right Angle Contact Type : Pin Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Tin
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Reel Packaging Quantity : 2500
Termination Features Product Terminates To : Printed Circuit Board
Usage Conditions Operating Temperature Range : -55 - 125 DEGC [-67 - 257 DEGF ]
Contact Features
Contact Base Material : Brass
Contact Current Rating (Max) (AMP) : 3
Contact Mating Area Plating Material : Tin
Contact Mating Area Plating Material Finish : Bright
Contact Mating Area Plating Material Thickness : 2.54 - 5.08 MICM [100 - 200 MICIN ]
Contact Orientation : Right Angle
Contact Type : Pin
Contact Underplating Material : Nickel
PCB Contact Termination Area Plating Material : Tin
Operation/Application
Circuit Application : Signal
Packaging Features
Packaging Method : Reel
Packaging Quantity : 2500
Termination Features
Product Terminates To : Printed Circuit Board
Usage Conditions
Operating Temperature Range : -55 - 125 DEGC [-67 - 257 DEGF ]
