Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 40 Contact Mating Area Plating Material : Silver (Ag) Contact Orientation : Straight Contact Type : Tab Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Silver Alloy
Mechanical Attachment PCB Mount Retention : Without Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Tray Packaging Quantity : 25
Termination Features Product Terminates To : Wire & Cable
TE Connectivity
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Description
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 40 Contact Mating Area Plating Material : Silver (Ag) Contact Orientation : Straight Contact Type : Tab Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Silver Alloy
Mechanical Attachment PCB Mount Retention : Without Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Tray Packaging Quantity : 25
Termination Features Product Terminates To : Wire & Cable
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 40 Contact Mating Area Plating Material : Silver (Ag) Contact Orientation : Straight Contact Type : Tab Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Silver Alloy
Mechanical Attachment PCB Mount Retention : Without Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Tray Packaging Quantity : 25
Termination Features Product Terminates To : Wire & Cable
Contact Features
Contact Base Material : Copper Alloy
Contact Current Rating (Max) (AMP) : 40
Contact Mating Area Plating Material : Silver (Ag)
Contact Orientation : Straight
Contact Type : Tab
Contact Underplating Material : Nickel
PCB Contact Termination Area Plating Material : Silver Alloy
