Contact Features Contact Base Material : Phosphor Bronze Contact Current Rating (Max) (AMP) : 3.1 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .762 MICM [30 MICIN ] Contact Size : Size 20 Contact Type : Socket Contact Underplating Material : Nickel Mating Pin Diameter : 1.02 MM [.04 INCH ] PCB Contact Termination Area Plating Material : Tin
Dimensions Wire Size (MMSQ) : .8 - .9 Wire Size (AWG) : 18
Mechanical Attachment Contact Retention Type Within Housing : Snap-In Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Loose Piece Packaging Quantity : 10000
Termination Features Product Terminates To : Wire & Cable Termination Method to Wire & Cable : Solder Termination Post & Tail Diameter : 2.16 MM [.085 INCH ] Termination Post & Tail Length : 9.4 MM [.37 INCH ]
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
TE Connectivity
Allied Electronics, Inc.
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Description
Contact Features Contact Base Material : Phosphor Bronze Contact Current Rating (Max) (AMP) : 3.1 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .762 MICM [30 MICIN ] Contact Size : Size 20 Contact Type : Socket Contact Underplating Material : Nickel Mating Pin Diameter : 1.02 MM [.04 INCH ] PCB Contact Termination Area Plating Material : Tin
Dimensions Wire Size (MMSQ) : .8 - .9 Wire Size (AWG) : 18
Mechanical Attachment Contact Retention Type Within Housing : Snap-In Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Loose Piece Packaging Quantity : 10000
Termination Features Product Terminates To : Wire & Cable Termination Method to Wire & Cable : Solder Termination Post & Tail Diameter : 2.16 MM [.085 INCH ] Termination Post & Tail Length : 9.4 MM [.37 INCH ]
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
Contact Features Contact Base Material : Phosphor Bronze Contact Current Rating (Max) (AMP) : 3.1 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .762 MICM [30 MICIN ] Contact Size : Size 20 Contact Type : Socket Contact Underplating Material : Nickel Mating Pin Diameter : 1.02 MM [.04 INCH ] PCB Contact Termination Area Plating Material : Tin
Dimensions Wire Size (MMSQ) : .8 - .9 Wire Size (AWG) : 18
Mechanical Attachment Contact Retention Type Within Housing : Snap-In Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Loose Piece Packaging Quantity : 10000
Termination Features Product Terminates To : Wire & Cable Termination Method to Wire & Cable : Solder Termination Post & Tail Diameter : 2.16 MM [.085 INCH ] Termination Post & Tail Length : 9.4 MM [.37 INCH ]
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
Contact Features
Contact Base Material : Phosphor Bronze
Contact Current Rating (Max) (AMP) : 3.1
Contact Mating Area Plating Material : Gold (Au)
Contact Mating Area Plating Material Thickness : .762 MICM [30 MICIN ]
Contact Size : Size 20
Contact Type : Socket
Contact Underplating Material : Nickel
Mating Pin Diameter : 1.02 MM [.04 INCH ]
PCB Contact Termination Area Plating Material : Tin
Dimensions
Wire Size (MMSQ) : .8 - .9
Wire Size (AWG) : 18
Mechanical Attachment
Contact Retention Type Within Housing : Snap-In
Wire Insulation Support : Without
Operation/Application
Circuit Application : Signal
Packaging Features
Packaging Method : Loose Piece
Packaging Quantity : 10000
Termination Features
Product Terminates To : Wire & Cable
Termination Method to Wire & Cable : Solder
Termination Post & Tail Diameter : 2.16 MM [.085 INCH ]
Termination Post & Tail Length : 9.4 MM [.37 INCH ]
Usage Conditions
Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
